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HMC276LP4ETR

Analog Devices

HMC276LP4ETR by Analog Devices

Analog Devices' HMC276LP4ETR is a GAAS SPDT RF switch with 2 functions, 24 terminals, and max freq of 3000 MHz. It offers -40 to 85 °C temp range, 7 dB insertion loss, and 31 dB isolation. Ideal for RF/microwave applications requiring fast 0.35 us on time and high compression point of 26 dBm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,698 parts In-Stock

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Digiode

USA . 551 parts In-Stock

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551

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Parana Technologies

USA . 2,040 parts In-Stock

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$1.194

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$1.111

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2,040

$1.194

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$1.111

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IDEA Electronic Components Group

UK . 1,725 parts In-Stock

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$1.284

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$1.220

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$1.284

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DigiPath Technology Company

USA . 2,029 parts In-Stock

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$2.003

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$1.923

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$2.003

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One Stop Electronics

USA . 1,132 parts In-Stock

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$3.000

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$3.000

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Ampacity Inc.

Singapore . 1,214 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 303 parts In-Stock

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$11.920

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Semicontronic

India . 1,149 parts In-Stock

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$40.000

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$39.000

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$38.800

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RC Electronics

USA . 19,953 parts In-Stock

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$3.040

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$2.750

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$2.660

19,953

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$3.040

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$2.660

Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 688 parts In-Stock

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Overview

Enhance your RF/Microwave system with the HMC276LP4ETR by Analog Devices, a top-quality SPDT switch that offers unparalleled performance and reliability. With its innovative GAAS technology and impressive compression point of 26 dBm, this switch ensures seamless operation at frequencies up to 3000 MHz. Whether you're in the aerospace, defense, or telecommunications industry, this versatile switch is perfect for a wide range of applications. Trust Analog Devices, a renowned manufacturer known for delivering cutting-edge solutions, to provide you with the value and benefits you need to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, ensuring long-term reliability.

No. of Functions: 2

Having 2 functions allows for versatility and the ability to switch between different modes or paths, increasing the flexibility of the device.

Compression Point (1 dB): 26 dBm

The high compression point of 26 dBm ensures that the device can handle high power levels without distortion, making it suitable for demanding applications.

Power Supplies (V): 5

Operating at 5V makes this device compatible with standard power supplies, simplifying integration into existing systems.

No. of Terminals: 24

Having 24 terminals allows for a wide range of connectivity options, enabling the device to interface with multiple components or circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the device can withstand elevated temperatures, making it suitable for use in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the device to function in cold conditions, expanding its range of potential applications.

Maximum Insertion Loss: 7 dB

With a maximum insertion loss of 7 dB, this device offers low signal loss and high signal integrity, ensuring optimal performance in signal switching applications.

Nominal On Time: 0.35 us

The nominal on time of 0.35 microseconds ensures fast switching speeds, making this device suitable for time-sensitive applications that require rapid response.

Technology: GAAS

Utilizing GaAs technology provides high-performance capabilities and low noise characteristics, making this device suitable for demanding RF and microwave applications.

RF or Microwave Device Type: SPDT

Being a single-pole, double-throw device offers options for switching between two separate RF or microwave paths, increasing functionality and versatility of the device.

Minimum Isolation: 31 dB

The high minimum isolation of 31 dB ensures minimal signal leakage between the input and output ports, maintaining signal integrity and minimizing interference.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables easy and secure installation on PCBs, saving space and allowing for efficient assembly in compact electronic systems.

Maximum Operating Frequency: 3000 MHz

Operating at a high frequency of 3000 MHz enables this device to handle high-speed RF and microwave signals, making it suitable for applications requiring fast data transmission.

Technical Specifications

RF/Microwave Switches HMC276LP4ETR attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

26 dBm

Maximum Insertion Loss:

7 dB

Minimum Isolation:

31 dB

Mounting Feature:

No. of Functions:

2

No. of Terminals:

24

Nominal On Time:

.35 us

Maximum Operating Frequency:

3000 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC24,.16SQ,20

Power Supplies (V):

5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Trade Compliance

HMC276LP4ETR RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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