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DS33X82+

Analog Devices

DS33X82+ by Analog Devices

Analog Devices' DS33X82+ is a network interface IC with 256 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It supports circuits for telecom applications at a nominal voltage of 1.8V.

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4

In-Stock Inventory

1k+

DS33X82+ by Analog Devices
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Analog Devices Inc

USA . 586 parts In-Stock

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586

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Vyrian

USA . 11,885 parts In-Stock

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Anansix

USA . 776 parts In-Stock

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776

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Digiode

USA . 618 parts In-Stock

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618

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Distributors (Availability)

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Native Components

USA . 881 parts In-Stock

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$0.491

100+ parts

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$0.471

881

$0.491

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$0.471

Northwest PG Solutions

USA . 1,714 parts In-Stock

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$0.540

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$0.476

1,714

$0.540

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$0.476

MARBEL Systems

Belgium . 4,233 parts In-Stock

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$11.601

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Texas Native Microelectronics

USA . 182 parts In-Stock

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$13.334

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$12.801

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$12.401

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$11.734

182

$13.334

$12.801

$12.401

$11.734

Kenton Components

USA . 100 parts In-Stock

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$16.001

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$14.081

100

$16.001

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$14.081

Qasali Group International

UK . 332 parts In-Stock

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$36.002

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$33.482

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$31.682

332

$36.002

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$33.482

$31.682

Component Stockers USA

USA . 630 parts In-Stock

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$99.990

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630

$99.990

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Semicontronic

India . 97 parts In-Stock

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$781.000

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$761.475

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$757.570

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97

$781.000

$761.475

$757.570

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QUARKTWIN TECHNOLOGY LTD

USA . 23,946 parts In-Stock

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Microchip USA

USA . 4,277 parts In-Stock

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Corphita

USA . 2,230 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Vigor

Singapore . 256 parts In-Stock

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256

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Overview

Elevate your network interfaces with the DS33X82+ by Analog Devices, a cutting-edge solution designed to deliver unmatched performance and reliability. With a focus on quality and precision engineering, Analog Devices sets the standard in the industry, ensuring that their products exceed expectations. The DS33X82+ is perfect for a wide range of applications in the telecom sector, providing seamless connectivity and superior circuit support. Experience the value and benefits of this exceptional product, offering customers the advantages they need to stay ahead in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape provides uniformity in design, making it easier to plan and layout on a PCB.

No. of Terminals: 256

With a high number of terminals, this product offers versatility in connectivity options, making it suitable for complex network setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes enhances conductivity and corrosion resistance, ensuring a stable connection over time.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and improves the overall aesthetics of the product.

Width: 17 mm

The compact width makes this product suitable for devices with limited space, without compromising on performance.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage ensures energy efficiency, making it an environmentally friendly choice for network interfaces.

Technical Specifications

Network Interfaces DS33X82+ attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.77 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DS33X82+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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