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DS33X81+

Analog Devices

DS33X81+ by Analog Devices

Analog Devices' DS33X81+ is a network interface IC with 256 terminals in a square grid array package. It operates b/w -40 to 85°C, supporting circuits at 1.8V supply voltage. Ideal for telecom applications, it has a compact size of 17x17mm and terminal pitch of 1mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

DS33X81+ by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,020 parts In-Stock

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1,020

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Anansix

USA . 1,366 parts In-Stock

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1,366

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Digiode

USA . 1,217 parts In-Stock

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1,217

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Vyrian

USA . 755 parts In-Stock

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755

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Nova Conductors

Japan . 150 parts In-Stock

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150

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MARBEL Systems

Belgium . 5,531 parts In-Stock

1+ parts

$8.848

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5,531

$8.848

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Texas Native Microelectronics

USA . 4,490 parts In-Stock

1+ parts

$10.170

100+ parts

$9.763

1k+ parts

$9.458

10k+ parts

$8.950

4,490

$10.170

$9.763

$9.458

$8.950

Kenton Components

USA . 3,309 parts In-Stock

1+ parts

$12.204

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$10.740

3,309

$12.204

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$10.740

Qasali Group International

UK . 1,820 parts In-Stock

1+ parts

$27.459

100+ parts

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$25.537

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$24.164

1,820

$27.459

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$25.537

$24.164

Semicontronic

India . 601 parts In-Stock

1+ parts

$867.000

100+ parts

$845.325

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$840.990

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601

$867.000

$845.325

$840.990

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Ampacity Inc.

Singapore . 969 parts In-Stock

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$871.000

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Microchip USA

USA . 2,784 parts In-Stock

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Vigor

Singapore . 896 parts In-Stock

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896

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Corphita

USA . 465 parts In-Stock

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465

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Elevate your network interfaces with the DS33X81+ by Analog Devices. Offering top-notch quality and reliability, Analog Devices is a trusted manufacturer in the industry. This versatile product is perfect for a wide range of applications, providing seamless connectivity and high performance. With its advanced technology and innovative design, the DS33X81+ delivers unparalleled value to customers, making it the ideal choice for all your networking needs. Experience the benefits and advantages of Analog Devices today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape design helps in efficient use of space on PCBs, especially in tight layouts.

No. of Terminals: 256

With 256 terminals, this product offers a high level of connectivity options for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal performance and electrical characteristics, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to perform effectively in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product remains operational even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-lasting functionality.

Terminal Position: BOTTOM

The terminals positioned at the bottom offer easy accessibility for connections and maintenance.

Maximum Seated Height: 1.77 mm

The low maximum seated height allows for a compact design, suitable for space-constrained applications.

Width: 17 mm

The 17 mm width provides a balance between size and functionality, making it versatile for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the product on the PCB for secure connections.

Length: 17 mm

The 17 mm length offers a compact form factor, suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh environmental conditions in commercial and industrial settings.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection for stable performance.

Telecom IC Type: SUPPORT CIRCUIT

The telecom IC type supports circuit connections for efficient data transmission in networking applications.

Nominal Supply Voltage: 1.8 V

The 1.8 V nominal supply voltage is ideal for low power consumption, making the product energy-efficient.

Terminal Pitch: 1 mm

The 1 mm terminal pitch offers compatibility with a wide range of devices and circuit boards for versatile applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is suitable for standard handling and storage conditions.

Technical Specifications

Network Interfaces DS33X81+ attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.77 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DS33X81+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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