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DS2180Q

Analog Devices

DS2180Q by Analog Devices

DS2180Q by Analog Devices is a CMOS IC with 44 terminals, operating at 5V. It has a temperature range of 0-70 °C and is used in T-1(DS1) carrier systems for telecom interfaces. The package style is chip carrier, making it suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,261 parts In-Stock

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Digiode

USA . 1,247 parts In-Stock

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Anansix

USA . 339 parts In-Stock

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339

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Electronic Expediters

USA . 15 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3 parts In-Stock

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Native Components

USA . 1,297 parts In-Stock

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$0.660

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$0.660

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MARBEL Systems

Belgium . 2,276 parts In-Stock

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$6.413

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$6.413

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Texas Native Microelectronics

USA . 4,587 parts In-Stock

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$7.371

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$7.076

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$6.855

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$6.486

4,587

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$6.486

Kenton Components

USA . 3,328 parts In-Stock

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$8.845

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$7.784

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AZTECH Wire

Italy . 498 parts In-Stock

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$16.952

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Modulus Dynamics

Lithuania . 2,045 parts In-Stock

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$19.683

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$19.683

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$19.683

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Qasali Group International

UK . 613 parts In-Stock

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$19.902

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$18.509

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$17.513

613

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Semicontronic

India . 1,598 parts In-Stock

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$388.000

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$378.300

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$376.360

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One Stop Electronics

USA . 1,665 parts In-Stock

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$633.000

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Northwest PG Solutions

USA . 2,605 parts In-Stock

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$4.854

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Corphita

USA . 369 parts In-Stock

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369

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Overview

Discover the DS2180Q by Analog Devices, a top-quality solution in the category of Other Function Telecom Interface ICs. With a reputation for excellence and reliability, Analog Devices delivers products that exceed expectations. The DS2180Q offers unmatched value with its versatile applications and innovative features. From its durable package body material to its high performance, this product is designed to enhance your projects while providing seamless integration. Experience the benefits of Analog Devices technology with the DS2180Q.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape provides a compact design, maximizing space efficiency on the PCB while maintaining a standardized form factor.

Power Supplies (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems and power sources.

No. of Terminals: 44

Having 44 terminals allows for versatile connection options and functionality, suitable for complex telecom interface applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high density integration and efficient heat dissipation, making it suitable for telecom interface ICs with performance requirements.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature environments, ensuring reliable performance under various conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows for operation in colder environments, making it versatile for use in different climates.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance in telecom applications.

Terminal Position: QUAD

The quad terminal position offers multiple connection points for increased flexibility and functionality in telecom systems.

Carrier Type-1: T-1(DS1)

The T-1(DS1) carrier type provides compatibility with legacy telecom systems, allowing for seamless integration and operation in existing infrastructure.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating conditions, making it suitable for a wide range of commercial telecom applications.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, making it ideal for telecom interface ICs that require efficient operation and signal integrity.

Terminal Form: J BEND

The J bend terminal form offers secure and reliable connections, reducing the risk of signal interference or disconnection in high-speed telecom applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and systems, simplifying integration and maintenance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for precise and compact PCB layout, essential for high-density telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs DS2180Q attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

Carrier Type-1:

T-1(DS1)

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

DS2180Q Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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