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ADSP21262SKBCZ200R

Analog Devices

ADSP21262SKBCZ200R by Analog Devices

ADSP21262SKBCZ200R by Analog Devices is a 32-bit DSP with 16-bit address and data bus width, operating at up to 66.67 MHz clock frequency. It features a low-profile grid array package suitable for digital signal processing applications requiring high-speed computation in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,830 parts In-Stock

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2,830

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VNN

France . 869 parts In-Stock

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869

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Digiode

USA . 225 parts In-Stock

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225

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 1,197 parts In-Stock

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$13.000

100+ parts

$12.675

1k+ parts

$12.610

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1,197

$13.000

$12.675

$12.610

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Parana Technologies

USA . 206 parts In-Stock

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$15.576

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$14.485

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206

$15.576

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$14.485

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

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$16.748

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$15.911

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$15.911

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2,033

$16.748

$15.911

$15.911

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AZTECH Wire

Italy . 416 parts In-Stock

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$18.808

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DigiPath Technology Company

USA . 224 parts In-Stock

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$26.127

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$25.082

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$25.082

224

$26.127

$25.082

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$25.082

One Stop Electronics

USA . 1,581 parts In-Stock

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$30.000

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$30.000

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Ampacity Inc.

Singapore . 652 parts In-Stock

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$31.000

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Corohmni

South Africa . 969 parts In-Stock

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$51.033

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Continental Prestige Electronics

USA . 4,792 parts In-Stock

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Argo Parts USA

USA . 2,612 parts In-Stock

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Corphita

USA . 856 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Unleash the power of cutting-edge technology with the ADSP21262SKBCZ200R by Analog Devices. As a leader in the digital signal processor category, Analog Devices delivers unmatched quality and reliability in every product. This DSP is designed to revolutionize your applications, offering unparalleled performance and efficiency. Experience seamless integration and exceptional versatility with this state-of-the-art device. Elevate your projects to new heights with the value and benefits that only Analog Devices can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good durability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

Operating within a safe supply voltage range ensures the device's stability and longevity.

Address Bus Width: 16

Having a wider address bus allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

The square package shape offers efficient use of space on the PCB and easier placement during assembly.

Bit Size: 32

With a 32-bit architecture, the DSP can handle complex signal processing tasks with higher precision and speed.

Power Supplies (V): 1.2,3.3

Compatible with multiple power supply voltages, offering flexibility in different operating environments.

No. of Terminals: 136

Having a high number of terminals allows for more input/output connections, expanding the device's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density packaging, reducing the footprint on the PCB and enhancing thermal performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption and operation even under low-power conditions.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold temperatures, ensuring reliability in various operating conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, prolonging the product's lifespan.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure PCB mounting and connections.

Maximum Seated Height: 1.7 mm

Low profile design with a maximum seated height of 1.7 mm saves space and enables compact device designs.

RAM Words: 65536

With a large RAM capacity, the DSP can store and process a significant amount of data, enhancing performance.

Width: 12 mm

Compact width of 12 mm enables easy integration into various electronic systems and devices.

Boundary Scan: YES

Supports boundary scan testing, facilitating efficient debugging and testing processes during manufacturing.

External Data Bus Width: 16

Having a wide external data bus width enables fast data transfer and efficient communication with external devices.

Maximum Clock Frequency: 66.67 MHz

High clock frequency allows for fast data processing and real-time signal handling, improving overall performance.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly, ensuring reliable solder connections.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and multitasking capabilities of the DSP.

Length: 12 mm

Compact length of 12 mm facilitates space-saving designs and easy integration into various electronic systems.

Temperature Grade: COMMERCIAL

Designed for commercial applications, offering reliable performance in standard operating temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Equipped with specialized peripheral ICs for efficient signal processing and versatile functionality in diverse applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital systems.

Terminal Form: BALL

Ball terminal form provides reliable solder connections and facilitates easy PCB mounting and integration.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V offers stable performance and efficient power consumption.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8 mm, the device enables high-density PCB designs and precise connections.

Format: FLOATING POINT

Supports floating-point data processing, enabling high-precision calculations for advanced signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard precautions for storage and handling.

Barrel Shifter: YES

Incorporating a barrel shifter enhances data manipulation capabilities, improving overall performance in complex processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADSP21262SKBCZ200R attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B136

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

136

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA136,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP21262SKBCZ200R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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