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ADSP-TS101SAB2Z100

Analog Devices

ADSP-TS101SAB2Z100 by Analog Devices

ADSP-TS101SAB2Z100 by Analog Devices is a 32-bit DSP with 484 terminals, operating at -40 to 85°C. It features a 64-bit external data bus width and low power mode, suitable for industrial applications requiring high-speed signal processing in a compact package.

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VNN

France . 18,949 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 531 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 358 parts In-Stock

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Semicontronic

India . 398 parts In-Stock

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Parana Technologies

USA . 455 parts In-Stock

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 11 parts In-Stock

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DigiPath Technology Company

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Vigor

Singapore . 3,363 parts In-Stock

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iodParts Technologies Inc.

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with the Analog Devices ADSP-TS101SAB2Z100 Digital Signal Processor. Manufactured by industry leader Analog Devices, this DSP offers unparalleled quality and performance in a wide range of applications. From audio processing to telecommunications, this versatile product provides customers with unmatched value, benefits, and advantages. Experience the next level of innovation with the ADSP-TS101SAB2Z100 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the DSP onto circuit boards, saving space and facilitating efficient manufacturing processes.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for reliable performance and flexibility in powering the DSP in various operating conditions.

Address Bus Width: 32

A wide address bus width enables the DSP to access a large memory space, facilitating faster data processing and optimal performance.

Package Shape: SQUARE

The square package shape provides uniformity in design and allows for easy alignment and placement of the DSP within electronic systems.

Bit Size: 32

A 32-bit architecture allows the DSP to handle complex calculations and data processing tasks with high precision and efficiency.

No. of Terminals: 484

The high number of terminals provides extensive connectivity options and enables the DSP to interface with multiple external components for enhanced functionality.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and helps in reducing power consumption during operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain stable performance under elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the DSP to function reliably in cold environments without compromising its performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers excellent conductivity and corrosion resistance, ensuring robust electrical connections for enhanced reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and maintenance of the DSP within electronic systems, improving accessibility and ease of use.

Maximum Seated Height: 2.5 mm

The low maximum seated height allows for a compact and space-efficient design, making the DSP suitable for applications with limited vertical clearance.

Width: 19 mm

The moderate width of the DSP facilitates easy integration into standard electronic layouts and ensures compatibility with standard size requirements.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during manufacturing and maintenance, ensuring quality control and reliability.

External Data Bus Width: 64

A wide external data bus width enhances data transfer speeds and processing efficiency, enabling the DSP to handle large volumes of data with ease.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during the manufacturing process, ensuring secure and durable connections for the DSP.

Internal Bus Architecture: SINGLE

A single internal bus architecture simplifies the design and operation of the DSP, optimizing performance and reducing complexity in data processing tasks.

Length: 19 mm

The moderate length of the DSP accommodates standard size requirements and allows for easy integration into various electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance of the DSP in harsh operating conditions commonly found in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of other peripherals alongside the digital signal processor enhances the functionality and versatility of the DSP, making it suitable for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable connections and simplifies the installation of the DSP onto circuit boards during manufacturing and assembly.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and efficient operation of the DSP within the specified voltage range, optimizing performance and reliability.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for densely packed connections and compact design layouts, saving space and enabling high-density integration of the DSP.

Format: FLOATING POINT

The floating-point format enables the DSP to handle complex mathematical calculations with high precision and accuracy, making it suitable for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level allows the DSP to withstand typical environmental conditions without compromising its reliability or performance.

Low Power Mode: YES

The low power mode enables energy-efficient operation of the DSP, extending battery life and reducing power consumption in portable and battery-powered devices.

Barrel Shifter: YES

The presence of a barrel shifter enhances the DSP's ability to perform complex shift operations quickly and efficiently, improving overall processing speed and performance.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-TS101SAB2Z100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-TS101SAB2Z100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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