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ADSP-3211SG/+

Analog Devices

ADSP-3211SG/+ by Analog Devices

Analog Devices' ADSP-3211SG/+ is a military-grade DSP peripheral IC with CMOS technology. Featuring 144 terminals in a square grid array package, it operates b/w -55°C to 125°C. Ideal for applications requiring high-performance signal processing and multiplication tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,758 parts In-Stock

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Digiode

USA . 437 parts In-Stock

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Native Components

USA . 736 parts In-Stock

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$0.097

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$0.093

736

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$0.093

Northwest PG Solutions

USA . 1,860 parts In-Stock

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$0.107

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$0.094

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One Stop Electronics

USA . 1,592 parts In-Stock

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$7.000

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Corohmni

South Africa . 2,439 parts In-Stock

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$15.970

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Semicontronic

India . 172 parts In-Stock

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$17.000

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$16.575

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$16.490

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AZTECH Wire

Italy . 691 parts In-Stock

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$17.810

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Parana Technologies

USA . 2,147 parts In-Stock

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$20.384

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$18.957

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IDEA Electronic Components Group

UK . 1,318 parts In-Stock

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$21.918

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$20.822

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DigiPath Technology Company

USA . 1,786 parts In-Stock

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$34.192

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$32.824

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$32.824

1,786

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Corphita

USA . 978 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the ADSP-3211SG/+ by Analog Devices. As a leader in DSP peripherals, Analog Devices delivers unmatched quality and reliability to meet the demands of military-grade applications. This versatile device boasts a square ceramic package with 144 terminals, making it perfect for a variety of advanced systems. Experience superior performance and precision with the ADSP-3211SG/+, offering customers unparalleled value and benefits for their projects. Elevate your designs with the trusted expertise of Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal performance, making this product suitable for applications where heat dissipation is important.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

No. of Terminals: 144

With 144 terminals, this product offers a high level of connectivity for interfacing with other components in a system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

DSP Peripherals ADSP-3211SG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P144

JESD-609 Code:

e0

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-3211SG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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