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ADSP-21992YBC

Analog Devices

ADSP-21992YBC by Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,855 parts In-Stock

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Digiode

USA . 868 parts In-Stock

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Native Components

USA . 621 parts In-Stock

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$1.369

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$1.369

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Northwest PG Solutions

USA . 299 parts In-Stock

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$1.505

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Ampacity Inc.

Singapore . 564 parts In-Stock

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$9.000

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Semicontronic

India . 832 parts In-Stock

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$18.000

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$17.550

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$17.460

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$18.000

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AZTECH Wire

Italy . 871 parts In-Stock

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$18.258

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Parana Technologies

USA . 368 parts In-Stock

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$24.507

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$22.792

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One Stop Electronics

USA . 376 parts In-Stock

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$26.000

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IDEA Electronic Components Group

UK . 522 parts In-Stock

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$26.352

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$25.034

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$30.757

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$27.989

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$25.221

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Corohmni

South Africa . 360 parts In-Stock

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$38.820

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DigiPath Technology Company

USA . 71 parts In-Stock

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$41.109

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$39.465

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QUARKTWIN TECHNOLOGY LTD

USA . 22,787 parts In-Stock

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Vigor

Singapore . 2,000 parts In-Stock

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Microchip USA

USA . 216 parts In-Stock

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Corphita

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Technical Specifications

Digital Signal Processors (DSPs) ADSP-21992YBC attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

240

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.85 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

ADSP-21992YBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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