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ADSP-21062LCSZ-160

Analog Devices

ADSP-21062LCSZ-160 by Analog Devices

ADSP-21062LCSZ-160 by Analog Devices is a 32-bit DSP with max clock freq of 40MHz. It has 3.3V power supply, 48-bit external data bus width, and operates in industrial temp range. Ideal for digital signal processing applications requiring high-speed computation and low power consumption.

Median Price

$282.040

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 19 parts In-Stock

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$282.040

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$265.120

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$239.740

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Distributors (In-Stock)

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Digiode

USA . 424 parts In-Stock

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$267.938

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Vyrian

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Chip Stock

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ComSIT Distribution GmbH

Germany . 1 parts In-Stock

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ComSIT USA

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AZTECH Wire

Italy . 509 parts In-Stock

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$9.510

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Parana Technologies

USA . 156 parts In-Stock

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$25.046

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$23.293

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IDEA Electronic Components Group

UK . 640 parts In-Stock

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$26.931

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$25.584

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DigiPath Technology Company

USA . 2,988 parts In-Stock

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$42.012

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$40.332

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$40.332

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$40.332

Corohmni

South Africa . 70 parts In-Stock

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$76.614

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Native Components

USA . 774 parts In-Stock

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$93.417

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$89.680

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Northwest PG Solutions

USA . 373 parts In-Stock

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$102.759

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Semicontronic

India . 19 parts In-Stock

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$239.730

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$233.737

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Corphita

USA . 806 parts In-Stock

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$253.836

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Vigor

Singapore . 2,149 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 2,585 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the Analog Devices ADSP-21062LCSZ-160 Digital Signal Processor. Known for their superior quality and innovation, Analog Devices delivers exceptional products that exceed expectations. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless operation and enhanced functionality with the ADSP-21062LCSZ-160, providing unmatched value and benefits to customers looking to elevate their projects to new heights. Upgrade your system today with this top-of-the-line solution from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easily portable and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, reducing production costs.

Maximum Supply Voltage: 3.45 V

A higher maximum supply voltage allows for greater flexibility and compatibility with a wider range of power sources.

Address Bus Width: 32

A wider address bus width enables the processor to handle larger amounts of memory, improving overall performance.

Package Shape: SQUARE

A square package shape allows for efficient use of space on circuit boards, optimizing design layout.

Bit Size: 32

A 32-bit processor can handle larger data chunks at once, resulting in faster processing speeds.

Power Supplies (V): 3.3

The standardized power supply of 3.3V ensures compatibility with common power sources and reduces the need for additional voltage regulators.

No. of Terminals: 240

Having a larger number of terminals allows for more connections and functionality, making the DSP versatile in various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, FINE PITCH

These package styles offer efficient heat dissipation and compact designs, enhancing the overall performance and reliability of the product.

Minimum Supply Voltage: 3.15 V

The lower minimum supply voltage ensures that the processor can operate effectively even with fluctuating power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this DSP suitable for use in a wide range of climatic conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in electronic assemblies.

Terminal Position: QUAD

Quad terminal position offers increased stability and electrical connectivity, reducing the risk of signal interference or loss.

Maximum Seated Height: 4.1 mm

A low seated height allows for the processor to be installed in slim devices, optimizing space utilization in compact designs.

RAM Words: 2097152

The large RAM capacity enables the processor to store and process a vast amount of data efficiently, improving overall performance.

Width: 32 mm

A compact width dimension ensures that the DSP can be integrated into space-constrained systems without compromising functionality.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, enhancing the overall reliability and maintainability of the product.

External Data Bus Width: 48

A wider external data bus enables faster data transfer rates between the processor and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency allows the DSP to process instructions at a rapid pace, resulting in improved real-time processing capabilities.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections during the manufacturing process, reducing the risk of defects or failures.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data routing and processing, improving overall system performance and speed.

Length: 32 mm

A compact length dimension ensures that the DSP can be integrated into space-constrained systems without compromising functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions, this DSP is suitable for use in harsh environments where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the versatility and compatibility of the DSP, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and extended battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliable solder connections, ensuring long-lasting performance and durability.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent operation, reducing the risk of voltage fluctuations impacting performance.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density mounting and reduced signal crosstalk, improving overall signal integrity and system reliability.

Format: FLOATING POINT

Support for floating-point format enables precise mathematical calculations and complex signal processing tasks, making this DSP ideal for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the DSP has moderate sensitivity to moisture, making it suitable for usage in environments with controlled humidity levels.

Low Power Mode: YES

The low power mode option allows for reduced energy consumption during idle or low processing load periods, extending battery life in portable devices.

Barrel Shifter: YES

The presence of a barrel shifter provides efficient data shifting capabilities, enabling quick and precise data manipulation operations, enhancing the processing speed and efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21062LCSZ-160 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

48

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G240

JESD-609 Code:

e3

Length:

32 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

240

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP240,1.3SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2097152

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

32 mm

Peripheral IC Type:

Trade Compliance

ADSP-21062LCSZ-160 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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