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ADRF6850BCPZ-R7

Analog Devices

ADRF6850BCPZ-R7 by Analog Devices

Analog Devices' ADRF6850BCPZ-R7 is a 56-terminal telecom IC with 3.3V supply, operating from -40 to 85°C. It features CMOS technology, matte tin finish, and quad terminal position. Ideal for telecom circuits, this square-shaped chip carrier has a very thin profile and peak reflow temp of 260°C.

Median Price

$20.597

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 41 parts In-Stock

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Vyrian

USA . 7,851 parts In-Stock

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VNN

France . 3,855 parts In-Stock

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USA . 3,760 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 743 parts In-Stock

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$6.831

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Parana Technologies

USA . 2,061 parts In-Stock

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$10.810

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$10.054

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Aztec Data Supply Inc.

USA . 122 parts In-Stock

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$10.890

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Corohmni

South Africa . 106 parts In-Stock

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

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$11.624

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$11.043

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$18.133

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$17.408

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Aranea Global

USA . 500 parts In-Stock

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$20.186

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$19.378

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Continental Prestige Electronics

USA . 3,362 parts In-Stock

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One Stop Electronics

USA . 1,253 parts In-Stock

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Semicontronic

India . 439 parts In-Stock

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$279.000

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$272.025

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$270.630

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Ampacity Inc.

Singapore . 431 parts In-Stock

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Lixinc

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Corphita

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Argo Parts USA

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Overview

Discover the cutting-edge ADRF6850BCPZ-R7 by Analog Devices, a top-tier manufacturer known for its superior quality. This innovative telecom interface IC is designed for a wide range of applications, offering unrivaled performance and reliability. With a compact square package shape and low power supply requirements, this chip carrier is perfect for industrial use. Experience seamless connectivity and enhanced functionality with the ADRF6850BCPZ-R7, providing customers with exceptional value and unmatched benefits in the telecommunications industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board, leading to a more compact and efficient design.

Power Supplies (V): 3.3

Operating at 3.3V makes this product compatible with a wide range of systems and reduces the need for additional voltage regulation circuitry.

No. of Terminals: 56

Having a higher number of terminals provides more connectivity options and flexibility in the circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function effectively in a wide range of temperature conditions, enhancing its versatility.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and ensures a reliable electrical connection, contributing to the overall durability and performance of the product.

Maximum Seated Height: 1 mm

The low profile design with a maximum seated height of 1mm helps in saving space and facilitates easier integration into compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade specification ensures that the product can withstand rugged conditions and operate reliably in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs ADRF6850BCPZ-R7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.44 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

ADRF6850BCPZ-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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