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ADN2531ACPZ

Analog Devices

ADN2531ACPZ by Analog Devices

ADN2531ACPZ by Analog Devices is a 16-terminal interface IC with a supply voltage range of 3V to 3.6V, operating from -40°C to 100°C. It features a square chip carrier package style suitable for industrial applications requiring very thin profile components. The IC is surface-mountable and has a terminal pitch of 0.5mm, making it ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,972 parts In-Stock

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4,972

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VNN

France . 870 parts In-Stock

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870

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Digiode

USA . 406 parts In-Stock

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406

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Nova Conductors

Japan . 26 parts In-Stock

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26

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Distributors (Availability)

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Ampacity Inc.

Singapore . 214 parts In-Stock

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$9.500

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214

$9.500

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Parana Technologies

USA . 1,981 parts In-Stock

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$9.577

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$8.907

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1,981

$9.577

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$8.907

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IDEA Electronic Components Group

UK . 663 parts In-Stock

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$10.298

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$9.783

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663

$10.298

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$9.783

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AZTECH Wire

Italy . 263 parts In-Stock

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$13.146

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263

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DigiPath Technology Company

USA . 416 parts In-Stock

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$16.065

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$15.422

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$15.422

416

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$15.422

One Stop Electronics

USA . 349 parts In-Stock

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$30.500

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349

$30.500

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Semicontronic

India . 157 parts In-Stock

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$40.500

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$39.488

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$39.285

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157

$40.500

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$39.285

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Lixinc

USA . 11,562 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 522 parts In-Stock

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A-Z Elektronik GmbH

Germany . 254 parts In-Stock

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254

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Microchip USA

USA . 168 parts In-Stock

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168

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Elevate your projects with the ADN2531ACPZ by Analog Devices, a top-tier manufacturer known for delivering superior quality in the realm of Other Function Interface ICs. This surface-mountable gem boasts a sleek package shape, 16 terminals, and an industrial temperature grade, making it ideal for a multitude of applications. With a nominal supply voltage of 3.3V and a maximum operating temperature of 100°C, this interface circuit will elevate your designs to new heights. Experience seamless integration and high performance with the ADN2531ACPZ - the perfect choice for those seeking excellence in their projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, making it suitable for a wide range of applications that require higher voltage levels.

Package Shape: SQUARE

Square package shape provides a compact and efficient form factor, optimizing space on the circuit board and enhancing overall design.

No. of Terminals: 16

Provides ample connectivity options with 16 terminals, allowing for versatile interfacing and integration within a circuit system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Features a chip carrier package style with a heat sink/slug and very thin profile, offering enhanced thermal management and space-saving benefits.

Minimum Supply Voltage: 3 V

Supports a low minimum supply voltage, ensuring compatibility with systems that operate on lower voltage levels.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures up to 100°C, suitable for industrial environments with demanding temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40°C, making it suitable for a wide range of temperature conditions and environments.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and reliable solder connections, ensuring long-term durability and performance.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity, enhancing overall signal transmission and system integrity.

Maximum Seated Height: 0.9 mm

Low maximum seated height of 0.9mm allows for a compact and slim profile, ideal for applications with space constraints.

Width: 3 mm

Narrow width of 3mm enables efficient placement on the circuit board, optimizing layout space and design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and assembly of the component, meeting industry standards.

Length: 3 mm

Compact length of 3mm offers a space-saving solution and facilitates efficient placement within the circuit system.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers RoHS compliance, ensuring eco-friendly and sustainable manufacturing practices.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable and consistent power delivery, ensuring reliable operation within the specified voltage range.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for precise and secure connections, enhancing signal integrity and overall performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates a moderate degree of moisture sensitivity during storage and handling, requiring standard precautions for moisture protection.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit IC, providing essential functionality for seamless communication and data exchange between various electronic components and systems.

Technical Specifications

Other Function Interface ICs ADN2531ACPZ attributes and parameters. Explore more Other Function Interface ICs devices from Analog Devices

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

ADN2531ACPZ Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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