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ADM1293-2AACPZ-RL

Analog Devices

ADM1293-2AACPZ-RL by Analog Devices

ADM1293-2AACPZ-RL by Analog Devices is a 16-terminal chip carrier with a very thin profile and quad terminal position. It operates in industrial temperatures from -40 to 105 °C, with a supply voltage range of 2.95V to 20V. Ideal for analog circuits, it is surface mountable and has a peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,312 parts In-Stock

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Conversion2

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 874 parts In-Stock

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874

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Distributors (Availability)

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Native Components

USA . 342 parts In-Stock

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$0.999

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342

$0.999

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Northwest PG Solutions

USA . 1,598 parts In-Stock

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$1.099

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1,598

$1.099

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Corohmni

South Africa . 47 parts In-Stock

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$3.678

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47

$3.678

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One Stop Electronics

USA . 430 parts In-Stock

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$6.500

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430

$6.500

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AZTECH Wire

Italy . 757 parts In-Stock

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$8.732

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757

$8.732

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Parana Technologies

USA . 5,829 parts In-Stock

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$18.568

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$17.269

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$18.568

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IDEA Electronic Components Group

UK . 247 parts In-Stock

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$19.966

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$18.968

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247

$19.966

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$18.968

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DigiPath Technology Company

USA . 5,829 parts In-Stock

1+ parts

$31.147

100+ parts

$29.901

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$29.901

5,829

$31.147

$29.901

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$29.901

QUARKTWIN TECHNOLOGY LTD

USA . 12,429 parts In-Stock

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GreenTree Electronics

Israel . 1,465 parts In-Stock

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Corphita

USA . 402 parts In-Stock

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402

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Microchip USA

USA . 150 parts In-Stock

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150

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Overview

Upgrade your electronic devices with the ADM1293-2AACPZ-RL from Analog Devices, a leading manufacturer in the industry. This high-quality product falls under the category of Other Function Semiconductors, offering versatility and reliability for various applications. With surface mount capabilities and a wide temperature range, this chip carrier ensures optimal performance in industrial settings. Trust Analog Devices to deliver cutting-edge technology that enhances your products and brings value to your customers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where board space is limited.

No. of Terminals: 16

With 16 terminals, this product offers a sufficient number of connections for versatile circuit implementations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal performance and overall efficiency of the product.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments or during temperature fluctuations.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring strong and reliable connections.

Terminal Position: QUAD

Quad terminal position simplifies the PCB layout and enables easy integration with other components.

Width (mm): 4 mm

The compact width of 4mm makes this product suitable for applications where space is a constraint.

Minimum Supply Voltage (Vsup): 2.95 V

The low minimum supply voltage requirement allows for operation in low-power applications, increasing energy efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures robust solder joints during the assembly process, contributing to product reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification indicates that the product meets the rigorous performance standards required for industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers better thermal performance compared to traditional lead-based packages.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm enables high-density mounting, making this product suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture, which is important for proper handling and storage to maintain performance.

Maximum Supply Voltage (Vsup): 20 V

The high maximum supply voltage rating allows for flexibility in power supply options and compatibility with various voltage levels.

Technical Specifications

Other Function Semiconductors ADM1293-2AACPZ-RL attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

2.95 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

ADM1293-2AACPZ-RL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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