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ADM1063ASUZ-REEL7

Analog Devices

ADM1063ASUZ-REEL7 by Analog Devices

ADM1063ASUZ-REEL7 by Analog Devices is a Power Management IC with 10 channels, operating at -40 to 85 °C. It features a 48-terminal flatpack package style and supports power supply circuits. Suitable for industrial applications, it has a max supply current of 6mA and peak reflow temperature of 260°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,101 parts In-Stock

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Digiode

USA . 108 parts In-Stock

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108

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Parana Technologies

USA . 1,100 parts In-Stock

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$3.841

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$3.572

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$3.841

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$3.572

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IDEA Electronic Components Group

UK . 437 parts In-Stock

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$4.130

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$3.924

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One Stop Electronics

USA . 1,301 parts In-Stock

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$4.500

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Ampacity Inc.

Singapore . 1,096 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 928 parts In-Stock

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$5.500

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$5.362

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$5.335

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928

$5.500

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$5.335

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DigiPath Technology Company

USA . 2,153 parts In-Stock

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$6.443

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$6.185

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Vigor

Singapore . 6,000 parts In-Stock

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$12.280

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AZTECH Wire

Italy . 414 parts In-Stock

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$18.728

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Microchip USA

USA . 1,348 parts In-Stock

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$45.271

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Native Components

USA . 511 parts In-Stock

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$275.620

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$270.108

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$267.351

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$264.595

511

$275.620

$270.108

$267.351

$264.595

Northwest PG Solutions

USA . 1,382 parts In-Stock

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Corphita

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Overview

Discover the power of the ADM1063ASUZ-REEL7 by Analog Devices, a top-tier Power Management IC that guarantees superior quality and reliability. Designed with cutting-edge technology, this product offers unparalleled performance in various applications. With its compact size and advanced features, it provides customers with optimal power supply support and efficiency. Trust Analog Devices for innovative solutions that deliver exceptional value and benefits, setting your projects apart from the competition. Choose the ADM1063ASUZ-REEL7 for your next power management needs and experience the difference in performance and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and compact integration onto circuit boards, making it suitable for small and space-constrained applications.

Power Supplies (V): 3/5

Supports multiple power supply voltages (3V and 5V), providing flexibility in power requirements for various devices.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on PCBs and ensures easy placement during assembly.

No. of Terminals: 48

High number of terminals allow for multiple connectivity options and interfaces, enabling complex circuit designs.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch design enables high-density mounting and improved thermal performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for usage in both extreme cold and hot conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance for prolonged product life.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection to other components, enhancing assembly efficiency.

Maximum Seated Height: 1.2 mm

Low seated height enables compact design and integration with other components in tight spaces.

Width (mm): 7 mm

Narrow width allows for placement in narrow areas on the PCB, optimizing space utilization.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Supports power supply functions, making it suitable for power management applications in various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process during assembly, reducing manufacturing time.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints and ensures product durability under thermal stress.

Length: 7 mm

Compact length makes it suitable for space-constrained applications, contributing to overall miniaturization of devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments, making it suitable for industrial applications.

Maximum Supply Current (Isup): 6 mA

Supports up to 6mA supply current, making it suitable for low power consumption devices and applications.

No. of Channels: 10

Multiple channels allow for handling and management of diverse signals or power sources, enhancing versatility in applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability for solder joints, ensuring long-term performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact layout design, contributing to miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Technical Specifications

Power Management ICs ADM1063ASUZ-REEL7 attributes and parameters. Explore more Power Management ICs devices from Analog Devices

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

ADM1063ASUZ-REEL7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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