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ADG3301BKSZ-REEL

Analog Devices

ADG3301BKSZ-REEL by Analog Devices

ADG3301BKSZ-REEL by Analog Devices is a small outline, thin profile interface IC with 6 terminals. It operates b/w -40 to 85 °C and supports supply voltages of 1.15-5.5V. Ideal for industrial applications requiring dual terminal position and shrink pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,920 parts In-Stock

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Digiode

USA . 189 parts In-Stock

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189

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Prism Electronics

USA . 7 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Native Components

USA . 266 parts In-Stock

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$0.500

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$0.500

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Northwest PG Solutions

USA . 1,924 parts In-Stock

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$0.549

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$0.485

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$0.485

Corohmni

South Africa . 767 parts In-Stock

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$3.931

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$3.931

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Parana Technologies

USA . 1,039 parts In-Stock

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$6.980

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$6.491

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

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$7.505

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$7.130

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AZTECH Wire

Italy . 313 parts In-Stock

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$8.859

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$8.859

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$10.129

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$9.217

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$8.306

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70

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$8.306

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DigiPath Technology Company

USA . 1,959 parts In-Stock

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$11.708

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$11.239

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$11.239

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Semicontronic

India . 1,493 parts In-Stock

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$38.500

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$37.538

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$37.345

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One Stop Electronics

USA . 1,544 parts In-Stock

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$44.500

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Vigor

Singapore . 7,930 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,854 parts In-Stock

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Corphita

USA . 812 parts In-Stock

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Microchip USA

USA . 243 parts In-Stock

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243

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Overview

Unlock seamless connectivity and enhance performance with the ADG3301BKSZ-REEL by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-quality interface ICs that are essential for a wide range of applications. This small outline, thin profile package offers customers unparalleled value with its high reliability, efficient power supplies, and durable construction. Whether you're working on industrial automation, consumer electronics, or telecommunications projects, this versatile IC is the perfect solution to streamline your designs and optimize functionality. Elevate your projects with Analog Devices today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the IC, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, making it versatile for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to handle and place on the circuit board during assembly.

Power Supplies (V): 1.2/5,1.8/5

Compatible with multiple power supply voltages, providing flexibility in design and application.

No. of Terminals: 6

Having 6 terminals allows for proper connectivity and communication within the circuit system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch saves space on the PCB and enables denser designs.

Minimum Supply Voltage: 1.15 V

Supports a low minimum supply voltage of 1.15V, making it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures up to 85 °C, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40 °C, ensuring performance in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish on terminals provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for better stability and connectivity in the circuit system.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1mm provides a slim profile for space-constrained designs.

Width: 1.25 mm

Narrow width of 1.25mm saves space on the PCB and enables compact designs.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for up to 40 seconds during assembly process.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperature of 260 °C during soldering process without damage.

Length: 2 mm

Short length of 2mm saves space on the PCB and enables compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit IC for reliable communication and data exchange between different components.

Technical Specifications

Other Function Interface ICs ADG3301BKSZ-REEL attributes and parameters. Explore more Other Function Interface ICs devices from Analog Devices

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

ADG3301BKSZ-REEL Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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