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ADG3300BRUZ-REEL

Analog Devices

ADG3300BRUZ-REEL by Analog Devices

ADG3300BRUZ-REEL by Analog Devices is a small outline, thin profile interface IC with 20 terminals. It operates b/w -40 to 85 °C and supports supply voltages of 1.15V to 5.5V. Ideal for industrial applications requiring precise signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,778 parts In-Stock

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8,778

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Digiode

USA . 657 parts In-Stock

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657

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Distributors (Availability)

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Native Components

USA . 633 parts In-Stock

1+ parts

$0.495

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633

$0.495

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Northwest PG Solutions

USA . 119 parts In-Stock

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$0.545

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$0.481

119

$0.545

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$0.481

Semicontronic

India . 562 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

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$7.275

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562

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 607 parts In-Stock

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$9.514

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607

$9.514

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Parana Technologies

USA . 3,997 parts In-Stock

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$11.048

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$10.275

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3,997

$11.048

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$10.275

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IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$11.880

100+ parts

$11.286

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$11.286

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674

$11.880

$11.286

$11.286

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DigiPath Technology Company

USA . 137 parts In-Stock

1+ parts

$18.533

100+ parts

$17.791

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$17.791

137

$18.533

$17.791

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$17.791

One Stop Electronics

USA . 345 parts In-Stock

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$20.500

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345

$20.500

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QUARKTWIN TECHNOLOGY LTD

USA . 9,514 parts In-Stock

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9,514

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Vigor

Singapore . 7,000 parts In-Stock

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7,000

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Microchip USA

USA . 5,349 parts In-Stock

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5,349

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Corphita

USA . 299 parts In-Stock

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299

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Overview

Enhance your electronic projects with the ADG3300BRUZ-REEL by Analog Devices, a top-quality interface IC that boasts reliability and precision. Manufactured by industry leader Analog Devices, this product offers seamless integration and exceptional performance in various applications. With its compact design and advanced features, this interface IC provides unparalleled value, efficiency, and versatility to customers. Upgrade your projects today with the ADG3300BRUZ-REEL and experience the difference Analog Devices can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Enables easy and efficient mounting onto a PCB, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources, increasing the versatility of the IC.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs and layouts.

Power Supplies (V): 1.2/5, 1.8/5

Supports multiple power supply options, enabling flexibility in voltage requirements for different applications.

No. of Terminals: 20

Provides ample connection points for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Promotes space efficiency and allows for compact designs in electronic systems.

Minimum Supply Voltage: 1.15 V

Ensures compatibility with low voltage power sources, expanding the range of applications for the IC.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature environments, making it versatile for various applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh and extreme temperature conditions, ensuring reliability in demanding environments.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for the terminals, extending the lifespan of the IC.

Terminal Position: DUAL

Allows for multiple connection options, enhancing flexibility in circuit configurations.

Maximum Seated Height: 1.2 mm

Low profile design enables compact and space-saving layouts in electronic systems.

Width: 4.4 mm

Compact width dimensions allow for efficient use of space on a PCB.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperature reflow processes during assembly, ensuring robust solder joints.

Length: 6.5 mm

Compact length dimensions contribute to space-efficient designs in electronic systems.

Temperature Grade: INDUSTRIAL

Designed to withstand the rigors of industrial environments, ensuring reliable performance in demanding conditions.

Terminal Form: GULL WING

Facilitates easy soldering onto a PCB, enhancing the reliability and durability of the connections.

Terminal Pitch: 0.65 mm

Fine pitch terminals allow for high-density mounting, enabling complex circuit designs within a small area.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components, making it an ideal choice for communication and control applications.

Technical Specifications

Other Function Interface ICs ADG3300BRUZ-REEL attributes and parameters. Explore more Other Function Interface ICs devices from Analog Devices

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADG3300BRUZ-REEL Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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