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AD8332ACP-R2

Analog Devices

AD8332ACP-R2 by Analog Devices

AD8332ACP-R2 by Analog Devices is a 32-terminal IC with a package style of CHIP CARRIER. It operates b/w -40 to 85 °C and requires a supply voltage of 4.5-5.5 V. Ideal for industrial applications requiring precise consumer circuit functionality in compact spaces.

Median Price

$15.490

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 1,000 parts In-Stock

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Rochester

USA . 595 parts In-Stock

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$15.490

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$13.860

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$13.050

595

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$15.490

$13.860

$13.050

Distributors (In-Stock)

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Digiode

USA . 582 parts In-Stock

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$16.406

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Vyrian

USA . 2,363 parts In-Stock

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Flip Electronics

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Native Components

USA . 567 parts In-Stock

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$0.042

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$0.040

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$0.040

Parana Technologies

USA . 1,833 parts In-Stock

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$1.663

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$1.546

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$1.663

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IDEA Electronic Components Group

UK . 1,048 parts In-Stock

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$1.788

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$1.699

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DigiPath Technology Company

USA . 1,868 parts In-Stock

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$2.789

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$2.678

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Semicontronic

India . 404 parts In-Stock

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$14.680

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$14.313

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$14.240

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$14.680

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Corphita

USA . 335 parts In-Stock

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$15.543

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AZTECH Wire

Italy . 164 parts In-Stock

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$16.540

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Vigor

Singapore . 675 parts In-Stock

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$16.580

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Northwest PG Solutions

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Microchip USA

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Overview

Discover the unparalleled quality and reliability of the AD8332ACP-R2 by Analog Devices, a leading manufacturer in the industry. This innovative consumer IC offers endless possibilities for applications in various industries, providing customers with unmatched value and benefits. With its surface mount capability, square package shape, and industrial temperature grade, this product is designed to exceed expectations. Trust Analog Devices to deliver cutting-edge technology that meets your needs and enhances your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto a circuit board, saving time and effort in the manufacturing process.

Package Shape: SQUARE

Square package shape allows for compact and efficient use of space on the circuit board.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic applications, ensuring compatibility and optimal performance in consumer devices.

No. of Terminals: 32

Sufficient number of terminals for connecting various components and interfaces in the circuit design.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile package style saves space and allows for a more compact overall design of the electronic device.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures without malfunctioning, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures without malfunctioning, ensuring reliable performance in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and electrical conductivity, ensuring secure connections during assembly.

Terminal Position: QUAD

Quad terminal position allows for easy placement and soldering onto the circuit board, improving assembly efficiency.

Maximum Seated Height: 1 mm

Low seated height saves space and allows for a more compact design of the electronic device.

Width: 5 mm

Compact width allows for efficient use of space on the circuit board, enabling a more streamlined design.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for compatibility with a wide range of power sources, making the product versatile.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures secure soldering during assembly, minimizing the risk of connection issues.

Length: 5 mm

Compact length allows for efficient use of space on the circuit board, enabling a more streamlined design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of hazardous substances, making the product more eco-friendly.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for a higher density of terminals on the package, enabling more connections in a compact space.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level indicates the product can withstand moderate exposure to moisture during handling and assembly.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance allows for compatibility with a wide range of power sources, improving versatility and design flexibility.

Technical Specifications

Other Function Consumer ICs AD8332ACP-R2 attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AD8332ACP-R2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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