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AD8232WACSZ-RL

Analog Devices

AD8232WACSZ-RL by Analog Devices

Analog Devices' AD8232WACSZ-RL is a 20-terminal IC with 3V supply voltage, operating from -40 to 105°C. Suitable for industrial applications, it features a square package shape, chip carrier style, and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,032 parts In-Stock

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VNN

France . 1,024 parts In-Stock

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Digiode

USA . 458 parts In-Stock

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458

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Nova Conductors

Japan . 47 parts In-Stock

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Semicontronic

India . 1,123 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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1,123

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 261 parts In-Stock

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$4.500

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$4.500

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One Stop Electronics

USA . 970 parts In-Stock

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$7.500

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970

$7.500

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Parana Technologies

USA . 5,858 parts In-Stock

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$15.420

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$14.341

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5,858

$15.420

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IDEA Electronic Components Group

UK . 977 parts In-Stock

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$16.581

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$15.752

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$15.752

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977

$16.581

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AZTECH Wire

Italy . 375 parts In-Stock

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$19.148

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$19.148

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DigiPath Technology Company

USA . 5,858 parts In-Stock

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$25.866

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$24.832

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$24.832

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$24.832

Argo Parts USA

USA . 2,717 parts In-Stock

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Continental Prestige Electronics

USA . 1,141 parts In-Stock

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Corphita

USA . 920 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your electronic designs with the AD8232WACSZ-RL from Analog Devices, a leader in semiconductor innovation. This versatile chip carrier offers exceptional performance in various applications, thanks to its industrial-grade quality and advanced analog circuit technology. With a very thin profile and a wide operating temperature range, this component provides reliability and precision for your projects. Trust Analog Devices to deliver top-notch solutions for your electronic needs, and experience the difference in performance that the AD8232WACSZ-RL can bring to your designs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a PCB, making it suitable for automated assembly processes.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3 V ensures compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the product to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can be used in both hot and cold environments.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections for better performance and reliability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design makes the product compact and suitable for space-constrained applications.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm allows for a low-profile design, which is advantageous in compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and provides a reliable electrical connection.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture, suitable for standard handling and storage procedures.

Technical Specifications

Other Function Semiconductors AD8232WACSZ-RL attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

AD8232WACSZ-RL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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