Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MAX5935CAX
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR;
R-PDSO-G36
15.375 mm
1
36
70 Cel
0 Cel
PLASTIC/EPOXY
SSOP
RECTANGULAR
SMALL OUTLINE, SHRINK PITCH
NOT SPECIFIED
2.65 mm
YES
BICMOS
TELECOM CIRCUIT
COMMERCIAL
GULL WING
.8 mm
DUAL
7.5 mm
PHY2078QT-BR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N32
e3
5 mm
32
95 Cel
-40 Cel
UNSPECIFIED
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
3.3 V
INDUSTRIAL
MATTE TIN
NO LEAD
.5 mm
QUAD
30
MAX2510EEI
MAX2510EEI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and max current of 25mA. Ideal for telecom interface applications due to its small outline package and industrial temperature grade.
R-PDSO-G28
e0
9.89 mm
28
85 Cel
SSOP28,.25
3/5
Not Qualified
1.75 mm
Other Telecom ICs
25 mA
3 V
BIPOLAR
TIN LEAD
.635 mm
3.9 mm
MAX2105CWI
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
17.9 mm
SOP
SMALL OUTLINE
245
5 V
1.27 mm
MAX2511EEI
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
1.73 mm
.045 mA
MAX3267CSA
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G8
4.9 mm
8
SOP8,.25
.05 mA
MAX3120CSA
MAX3120CUA
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
S-PDSO-G8
3 mm
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
.65 mm
MAX3120ESA
MAX3120ESA by Maxim Integrated is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates b/w -40 to 85°C, in industrial settings. This small outline package has a gull wing terminal form and is ideal for telecom circuit applications.
MAX3120EUA
MAX3120EUA by Maxim Integrated is an 8-terminal IC with a supply voltage of 3.3V, operating b/w -40 to 85°C. It features a small outline package style and gull wing terminal form, suitable for telecom circuit applications requiring surface mount technology.
MAX2472EUT-T
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
R-PDSO-G6
2.9 mm
6
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.45 mm
.95 mm
1.625 mm
MAX2473EUT-T
MAX3750CEE
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;
R-PDSO-G16
16
HSSOP
SSOP16,.25
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
3.3
.084 mA
MAX3751CEE
4.89 mm
.078 mA
MAX3265CUB
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;
S-PDSO-G10
10
HTSSOP
TSSOP10,.19,20
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
240
3.3/5
ATM/SONET/SDH ICs
.076 mA
20
MAX3265CUE
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;
TSSOP16,.25
4.4 mm
MAX3268CUB
.062 mA
MAX3269CUB
Tin/Lead (Sn85Pb15)
MAX3265EUE
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;
MAX3750CEE-T
MAX2370ETM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N48
7 mm
48
LCC48,.27SQ,20
3
.087 mA
MAX19713ETN
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N56
56
LCC56,.27SQ,16
1.8/3.3,3
Modems
.0306 mA
CMOS
.4 mm
MAX7031HATJ17
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
125 Cel
LCC32,.2SQ,20
2.5/5
2.7 V
AUTOMOTIVE
MAX2370ETM-T
MAX2023ETX-T
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: VQCCN; Package Shape: SQUARE;
S-XQCC-N36
6 mm
VQCCN
LCC36,.25SQ,20
CHIP CARRIER, VERY THIN PROFILE
5
.345 mA
MAX2023ETX
DS31256B
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
S-PBGA-B256
27 mm
256
BGA
GRID ARRAY
2.54 mm
BALL
BOTTOM
DS2291/87-22291-000
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
R-XSMA-N30
MICROELECTRONIC ASSEMBLY
NO
SINGLE
MAX3277U/D
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 9; Package Code: DIE; Package Shape: RECTANGULAR;
R-XUUC-N9
9
DIE
DIE OR CHIP
UNCASED CHIP
.041 mA
OTHER
UPPER
DS1852B-000
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B25
25
100 Cel
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.5 mm
DS2174QN
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
S-PQCC-J44
16.585 mm
44
QCCJ
LDCC44,.7SQ
CHIP CARRIER
4.57 mm
.06 mA
J BEND
DS2174Q
DS2174Q by Maxim Integrated is a 44-terminal telecom IC with 3.3V supply voltage, suitable for telecom circuit applications. It features a square chip carrier package style, operates b/w 0-70°C temperature range, and has a low supply current of 0.06mA. Ideal for telecommunications interfaces requiring surface mount technology in commercial-grade environments.
MAX3953UGK
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N68
10 mm
68
LCC68,.45SQ,20
.9 mm
.58 mA
MAX3268CUB-T
MAX3768CUB
MAX7044AKA-T
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
TSSOP8,.1
2.7
.0257 mA
MAX1470EUI-T
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
9.7 mm
MAX2511EEI-T
MAX3658AETA-T
MAX3658AETA-T by Maxim Integrated is a telecom IC with 3.3V supply, operating from -40 to 85°C. It features 8 terminals in a small outline package suitable for telecom circuits. With low power consumption of 0.026mA, it's ideal for various telecom interface applications.
S-XDSO-N8
HVSON
SOLCC8,.12,25
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.026 mA
MAX3768CUB-T
MAX3804ETE-T
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N16
LCC16,.12SQ,20
1.8/3.3,3.3
MAX3964AETP
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N20
4 mm
LCC20,.16SQ,20
MAX2150ETI
TELECOM CIRCUIT; JESD-609 Code: e0; Terminal Finish: TIN LEAD; Power Supplies (V): 3/3.3; Qualification: Not Qualified; Moisture Sensitivity Level (MSL): 1;
3/3.3
MAX19705ETM
.0125 mA
MAX19706ETM
.02 mA
MAX19708ETM
.016 mA
MAX7030HATJ
.0204 mA
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