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4 Other Function Telecom Interface ICs 11

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
SL2S2002FUD,003 by NXP Semiconductors

SL2S2002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S2102FUD,003 by NXP Semiconductors

SL2S2102FUD,003

NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5002FUD,003 by NXP Semiconductors

SL2S5002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5102FUD,003 by NXP Semiconductors

SL2S5102FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5302FUD,003 by NXP Semiconductors

SL2S5302FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5402FUD,003 by NXP Semiconductors

SL2S5402FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL3S1203FUF,003 by NXP Semiconductors

SL3S1203FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

SL3S1213FUF,003 by NXP Semiconductors

SL3S1213FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

TCP-4112UB-DT by Onsemi

TCP-4112UB-DT

Onsemi

TCP-4112UB-DT by Onsemi is a Telecom IC with 4 terminals in a grid array package. It operates b/w -30 °C to 85°C, with terminal finish in nickel gold. With a very thin profile of 0.345mm, it is suitable for telecom circuit applications.

R-PBGA-B4

e4

.626 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

TCP-4182UB-DT by Onsemi

TCP-4182UB-DT

Onsemi

TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.

R-PBGA-B4

e4

1.009 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

HMC7891 by Analog Devices

HMC7891

Analog Devices

Analog Devices' HMC7891 is a RECTANGULAR IC with 4 terminals, FLANGE MOUNT package style. Operating from -40 to 85 °C, it's an INDUSTRIAL-grade TELECOM CIRCUIT with 8V supply voltage. Ideal for telecom interfaces and other applications requiring high reliability in harsh environments.

R-XXFM-X4

1

1

4

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

FLANGE MOUNT

8 V

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED