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1932 Other Function Telecom Interface ICs 4

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
PM5980B-FEI by Microchip Technology

PM5980B-FEI

Microchip Technology

PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5981B-FEI by Microchip Technology

PM5981B-FEI

Microchip Technology

PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5990B-FEI by Microchip Technology

PM5990B-FEI

Microchip Technology

PM5990B-FEI by Microchip Technology is a GRID ARRAY IC with 1932 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5991B-FEI by Microchip Technology

PM5991B-FEI

Microchip Technology

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM