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LFBGA Network Interfaces 12

Network Interfaces
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Data Rate JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
PX1011B-EL1/N,551 by NXP Semiconductors

PX1011B-EL1/N,551

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

9 mm

PX1012A-EL1/G,551 by NXP Semiconductors

PX1012A-EL1/G,551

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.25 V

YES

INTERFACE CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

9 mm

PX1011A-EL1/G,557 by NXP Semiconductors

PX1011A-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

PX1011A-EL1:557 by NXP Semiconductors

PX1011A-EL1:557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

1

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011B-EL1/G,557 by NXP Semiconductors

PX1011B-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011B-EL1/N,557 by NXP Semiconductors

PX1011B-EL1/N,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011BI-EL1/G,557 by NXP Semiconductors

PX1011BI-EL1/G,557

NXP Semiconductors

NXP Semiconductors' PX1011BI-EL1/G,557 is a network interface with 81 terminals in a square package. It operates b/w -40 to 85°C and has a low profile of 1.6mm height. Ideal for industrial telecom applications requiring a 1.2V supply voltage and fine pitch grid array style.

S-PBGA-B81

9 mm

3

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

9 mm

PX1012A-EL1/G,557 by NXP Semiconductors

PX1012A-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

PX1012AI-EL1/G,557 by NXP Semiconductors

PX1012AI-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

AD9375BBCZ-REEL by Analog Devices

AD9375BBCZ-REEL

Analog Devices

AD9375BBCZ-REEL by Analog Devices is a network interface IC with 196 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a low profile of 1.27mm and fine pitch of 0.8mm, it offers a nominal voltage of 1.3V for seamless integration.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

AD9375BBCZ by Analog Devices

AD9375BBCZ

Analog Devices

AD9375BBCZ by Analog Devices is a network interface IC with 196 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. Features include low profile design, fine pitch style, and ball terminal form for reliable connectivity.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

BCM53158XUB1KFBG by Broadcom

BCM53158XUB1KFBG

Broadcom

BCM53158XUB1KFBG by Broadcom is a Network Interfaces IC with 311 terminals in a square package. It operates b/w 0-70°C, suitable for Ethernet transceiver applications. The low-profile grid array design has a terminal pitch of 0.65mm and uses Tin Silver Copper finish.

S-PBGA-B311

e1

13 mm

3

1

311

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.337 mm

1 V

YES

ETHERNET TRANSCEIVER

COMMERCIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

13 mm