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NXP Semiconductors Cellphone ICs 25

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
BGA7210 by NXP Semiconductors

BGA7210

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

SA601DK,112 by NXP Semiconductors

SA601DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA601DK,118 by NXP Semiconductors

SA601DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA620DK,112 by NXP Semiconductors

SA620DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA620DK,118 by NXP Semiconductors

SA620DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

A3I25X050GNR1 by NXP Semiconductors

A3I25X050GNR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

e3

3

260

RF AND BASEBAND CIRCUIT

TIN

40

BGA7204,115 by NXP Semiconductors

BGA7204,115

NXP Semiconductors

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.85 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

5 mm

BGA7210,515 by NXP Semiconductors

BGA7210,515

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGA7210X by NXP Semiconductors

BGA7210X

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.85 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGA7350,115 by NXP Semiconductors

BGA7350,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

5 mm

BGA7350,515 by NXP Semiconductors

BGA7350,515

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

BGU7060Y by NXP Semiconductors

BGU7060Y

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7061,518 by NXP Semiconductors

BGU7061,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7062,518 by NXP Semiconductors

BGU7062,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,115 by NXP Semiconductors

BGU7063,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,518 by NXP Semiconductors

BGU7063,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

30

8 mm

BLM6G10-30G,118 by NXP Semiconductors

BLM6G10-30G,118

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;

R-PDSO-G16

e3

15.9 mm

3

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

3.6 mm

28 V

YES

BASEBAND CIRCUIT

TIN

GULL WING

1.37 mm

DUAL

30

11 mm

BLM6G10-30G,135 by NXP Semiconductors

BLM6G10-30G,135

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 15.9 mm;

R-PDSO-G16

e3

15.9 mm

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.6 mm

28 V

YES

BASEBAND CIRCUIT

Tin (Sn)

GULL WING

1.37 mm

DUAL

11 mm

A2I25H060GNR1 by NXP Semiconductors

A2I25H060GNR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PDSO-G17

e3

17.53 mm

3

1

17

PLASTIC/EPOXY

HSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG

260

2.67 mm

28 V

YES

LDMOS

RF AND BASEBAND CIRCUIT

TIN

GULL WING

DUAL

40

9.02 mm

A2I25H060NR1 by NXP Semiconductors

A2I25H060NR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

R-PDSO-G17

e3

17.53 mm

3

1

17

PLASTIC/EPOXY

HSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG

260

2.67 mm

28 V

YES

LDMOS

RF AND BASEBAND CIRCUIT

TIN

GULL WING

DUAL

40

9.02 mm

MHT2001NR1 by NXP Semiconductors

MHT2001NR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Finish: TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

e3

3

260

RF AND BASEBAND CIRCUIT

TIN

40

AFSC5G26D37T2 by NXP Semiconductors

AFSC5G26D37T2

NXP Semiconductors

RF AND BASEBAND CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;

e4

3

260

RF AND BASEBAND CIRCUIT

NICKEL GOLD

40

MWPR1124ZVHT by NXP Semiconductors

MWPR1124ZVHT

NXP Semiconductors

RF AND BASEBAND CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD;

e4

3

260

RF AND BASEBAND CIRCUIT

NICKEL GOLD

40

A3I25X050NR1 by NXP Semiconductors

A3I25X050NR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;

e3

3

260

RF AND BASEBAND CIRCUIT

TIN

40

WLAN7102CZ by NXP Semiconductors

WLAN7102CZ

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .7 mm;

S-PQCC-N16

2 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.07SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.7 mm

214 mA

3.85 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.4 mm

QUAD

2 mm