Loading...

VFBGA Cellphone ICs 4

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
CC1000YZR by Texas Instruments

CC1000YZR

Texas Instruments

CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

CC1000YZ by Texas Instruments

CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

MAX4003EBL by Maxim Integrated

MAX4003EBL

Maxim Integrated

MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

MAX4003EBL-T by Maxim Integrated

MAX4003EBL-T

Maxim Integrated

MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm