Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX9-3FTG256I by Xilinx

XC6SLX9-3FTG256I

Xilinx

Xilinx XC6SLX9-3FTG256I FPGA features 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing, it operates at temperatures ranging from -40 to 100°C with a low profile grid array package style.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-3TQG144C by Xilinx

XC6SLX9-3TQG144C

Xilinx

The Xilinx XC6SLX9-3TQG144C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

9152

102

102

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC6SLX9-L1CPG196I by Xilinx

XC6SLX9-L1CPG196I

Xilinx

The Xilinx XC6SLX9-L1CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and 100 inputs/outputs. It operates at a voltage range of 0.95V to 1.05V and has a max combinatorial delay of 0.46ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

100

100

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-L1CSG225C by Xilinx

XC6SLX9-L1CSG225C

Xilinx

The Xilinx XC6SLX9-L1CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. It operates at voltages of 1.05V and supports CMOS technology. Ideal for applications requiring high-speed processing in compact designs with low power consumption.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG225I by Xilinx

XC6SLX9-L1CSG225I

Xilinx

Xilinx XC6SLX9-L1CSG225I is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. Operating at max voltage of 1.05V, it's ideal for industrial applications requiring high combinatorial delay performance in a compact package. With a grid array style and low profile design, it offers versatility in various electronic systems.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG324I by Xilinx

XC6SLX9-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

200

200

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-L1FT256I by Xilinx

XC6SLX9-L1FT256I

Xilinx

XC6SLX9-L1FT256I by Xilinx is a FPGA with 9152 logic cells, 715 CLBs, and 186 inputs/outputs. Operating at 1.05V, it offers 0.46ns combinatorial delay per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-L1FTG256C by Xilinx

XC6SLX9-L1FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1FTG256I by Xilinx

XC6SLX9-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1TQG144C by Xilinx

XC6SLX9-L1TQG144C

Xilinx

The Xilinx XC6SLX9-L1TQG144C is a FPGA with 9152 logic cells, 715 CLBs, and 102 inputs/outputs. It operates at voltages of 0.95-1.05 V and temperatures from 0-85°C. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment or industrial control systems.

FPGA

9152

102

102

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XA3S100E-4TQG144Q by Xilinx

XA3S100E-4TQG144Q

Xilinx

XA3S100E-4TQG144Q by Xilinx is a FPGA with 2160 logic cells, 240 CLBs, and 100000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. With a package size of 20x20 mm and low profile flatpack style, it's ideal for compact designs in harsh environments.

FPGA

2160

108

80

240

100000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S100E-4VQG100Q by Xilinx

XA3S100E-4VQG100Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

2160

66

59

240

100000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

XA3S1200E-4FGG400Q by Xilinx

XA3S1200E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1200E-4FTG256Q by Xilinx

XA3S1200E-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S1600E-4FGG400I by Xilinx

XA3S1600E-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG400Q by Xilinx

XA3S1600E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG484Q by Xilinx

XA3S1600E-4FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S250E-4CPG132Q by Xilinx

XA3S250E-4CPG132Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

AEC-Q100

XA3S250E-4FTG256Q by Xilinx

XA3S250E-4FTG256Q

Xilinx

XA3S250E-4FTG256Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. The package style is grid array with low profile, making it ideal for compact designs in harsh environments.

FPGA

5508

172

132

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S250E-4PQG208Q by Xilinx

XA3S250E-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5508

158

126

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S250E-4TQG144Q by Xilinx

XA3S250E-4TQG144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

5508

108

80

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S250E-4VQG100I by Xilinx

XA3S250E-4VQG100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

5508

66

59

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

XA3S250E-4VQG100Q by Xilinx

XA3S250E-4VQG100Q

Xilinx

XA3S250E-4VQG100Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. Operating at 572 MHz, it's ideal for automotive applications due to AEC-Q100 screening and CMOS technology. With a compact form factor of 14mm x 14mm and low power consumption at 1.2V, it's suitable for various embedded systems.

FPGA

5508

66

59

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

XA3S500E-4FTG256I by Xilinx

XA3S500E-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S500E-4PQG208Q by Xilinx

XA3S500E-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XC6VCX130T-1FFG1156I by Xilinx

XC6VCX130T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

128000

600

600

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX130T-1FFG484C by Xilinx

XC6VCX130T-1FFG484C

Xilinx

The Xilinx XC6VCX130T-1FFG484C is a FPGA with 128,000 logic cells and 10,000 CLBs. Operating at a max frequency of 1098 MHz, it's ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package. With low combinatorial delay and multiple power supply options, this CMOS technology device offers versatile solutions for various electronic designs.

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VCX130T-1FFG484I by Xilinx

XC6VCX130T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.2/2.5,2.5;

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VCX130T-1FFG784C by Xilinx

XC6VCX130T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-1FFG784I by Xilinx

XC6VCX130T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-2FFG1156C by Xilinx

XC6VCX130T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

10000

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-1FFG1156C by Xilinx

XC6VCX195T-1FFG1156C

Xilinx

XC6VCX195T-1FFG1156C by Xilinx is a CMOS-based FPGA with 199,680 logic cells and 15,600 CLBs. It operates at a max clock frequency of 1098 MHz and has a package style of grid array. This FPGA is commonly used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

199680

600

600

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-1FFG1156I by Xilinx

XC6VCX195T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

199680

600

600

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-1FFG784I by Xilinx

XC6VCX195T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

199680

400

400

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX195T-2FF784I by Xilinx

XC6VCX195T-2FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VCX195T-2FFG1156C by Xilinx

XC6VCX195T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

600

600

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-2FFG784C by Xilinx

XC6VCX195T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX240T-1FFG784I by Xilinx

XC6VCX240T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

241152

400

400

18840

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX240T-2FFG1156I by Xilinx

XC6VCX240T-2FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.2/2.5,2.5;

FPGA

241152

600

600

18840

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX75T-1FFG784C by Xilinx

XC6VCX75T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-1FFG784I by Xilinx

XC6VCX75T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-2FFG784I by Xilinx

XC6VCX75T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1098 MHz;

FPGA

74496

360

360

5820

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XA7A100T-1FGG484Q by Xilinx

XA7A100T-1FGG484Q

Xilinx

XA7A100T-1FGG484Q by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology. With a compact form factor (23mm x 23mm), it's ideal for high-performance computing in harsh environments.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-2FGG484Q by Xilinx

XA6SLX45-2FGG484Q

Xilinx

XA6SLX45-2FGG484Q by Xilinx is a 1.2V FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5MHz. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125°C.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2

1.2,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XC5VLX155T-1FF1136I by Xilinx

XC5VLX155T-1FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

640

640

12160

0.9 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VFX100T-1FF1136I by Xilinx

XC5VFX100T-1FF1136I

Xilinx

Xilinx XC5VFX100T-1FF1136I FPGA features 102400 logic cells, 8000 CLBs, and 640 inputs/outputs. Ideal for industrial applications with a max operating temperature of 100°C. Utilizes CMOS technology with a supply voltage range of 0.95V to 2.5V for versatile performance in various electronic systems.

FPGA

102400

640

640

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VFX100T-1FF1738C by Xilinx

XC5VFX100T-1FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX100T-1FF1738I by Xilinx

XC5VFX100T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No