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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VSX25-10FFG668C by Xilinx

XC4VSX25-10FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

23040

320

320

2560

1028 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX25-10FFG668I by Xilinx

XC4VSX25-10FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

FPGA

23040

320

320

2560

1028 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX35-10FFG668C by Xilinx

XC4VSX35-10FFG668C

Xilinx

XC4VSX35-10FFG668C by Xilinx is a FPGA with 34560 logic cells, 3840 CLBs, and 448 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

34560

448

448

3840

1028 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX35-10FFG668I by Xilinx

XC4VSX35-10FFG668I

Xilinx

XC4VSX35-10FFG668I by Xilinx is a FPGA with 34560 logic cells, 3840 CLBs, and max clock frequency of 1028 MHz. It operates at 1.2V nominal voltage and is ideal for high-performance computing applications requiring fast processing speeds in compact designs.

FPGA

34560

448

448

3840

1028 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX35-11FFG668C by Xilinx

XC4VSX35-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX35-11FFG668I by Xilinx

XC4VSX35-11FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Organization: 3840 CLBS;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VSX35-12FFG668C by Xilinx

XC4VSX35-12FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No