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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VFX12-10FF668I by Xilinx

XC4VFX12-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA668,26X26,40;

FPGA

12312

320

320

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-10FF668C by Xilinx

XC4VLX40-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-10FF668I by Xilinx

XC4VLX40-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 448;

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-11FF668I by Xilinx

XC4VLX40-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-12FF668C by Xilinx

XC4VLX40-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-10FF668C by Xilinx

XC4VLX60-10FF668C

Xilinx

XC4VLX60-10FF668C by Xilinx is a FPGA with 59904 logic cells, 6656 CLBs, and 448 inputs/outputs. Operating at up to 1028 MHz, it's ideal for high-speed applications like telecommunications equipment and industrial automation systems. With a package style of grid array and CMOS technology, it offers flexibility in design while maintaining reliability.

FPGA

59904

448

448

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-10FF668I by Xilinx

XC4VLX60-10FF668I

Xilinx

The Xilinx XC4VLX60-10FF668I FPGA features 59904 logic cells, 6656 CLBs, and a max clock frequency of 1028 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

59904

448

448

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-11FF668C by Xilinx

XC4VLX60-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

59904

448

448

6656

1205 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-11FF668I by Xilinx

XC4VLX60-11FF668I

Xilinx

XC4VLX60-11FF668I by Xilinx is a FPGA with 59904 logic cells, 6656 CLBs, and max clock frequency of 1205 MHz. It's used in applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

59904

448

448

6656

1205 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-12FF668C by Xilinx

XC4VLX60-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

59904

448

448

6656

1205 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX25-10FF668C by Xilinx

XC4VSX25-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

23040

320

320

2560

1028 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX25-10FF668I by Xilinx

XC4VSX25-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 320;

FPGA

23040

320

320

2560

1028 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX25-11FF668C by Xilinx

XC4VSX25-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

23040

320

320

2560

1205 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX25-11FF668I by Xilinx

XC4VSX25-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

FPGA

23040

320

320

2560

1205 MHz

CMOS

Field Programmable Gate Arrays

2560 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX35-10FF668C by Xilinx

XC4VSX35-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1028 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX35-10FF668I by Xilinx

XC4VSX35-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

34560

448

448

3840

1028 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX35-11FF668C by Xilinx

XC4VSX35-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX35-11FF668I by Xilinx

XC4VSX35-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VSX35-12FF668C by Xilinx

XC4VSX35-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

34560

448

448

3840

1205 MHz

CMOS

Field Programmable Gate Arrays

3840 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX15-10FF668C by Xilinx

XC4VLX15-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX15-10FF668I by Xilinx

XC4VLX15-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX15-11FF668C by Xilinx

XC4VLX15-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-10FF668C by Xilinx

XC4VLX25-10FF668C

Xilinx

XC4VLX25-10FF668C by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 448 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-10FF668I by Xilinx

XC4VLX25-10FF668I

Xilinx

XC4VLX25-10FF668I by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 448 inputs/outputs. Operating at max frequency of 1028 MHz, it's ideal for high-speed applications like telecommunications and signal processing due to its advanced CMOS technology.

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-11FF668C by Xilinx

XC4VLX25-11FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-11FF668I by Xilinx

XC4VLX25-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 24192;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX25-12FF668C by Xilinx

XC4VLX25-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VFX12-10FFG668C by Xilinx

XC4VFX12-10FFG668C

Xilinx

XC4VFX12-10FFG668C by Xilinx is a FPGA with 12312 logic cells, 1368 CLBs, and 320 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

12312

320

320

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VFX12-10FFG668I by Xilinx

XC4VFX12-10FFG668I

Xilinx

XC4VFX12-10FFG668I by Xilinx is a FPGA with 12312 logic cells, 1368 CLBs, and 320 inputs/outputs. It operates at max frequency of 1028 MHz and has a package size of 27mm x 27mm. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

FPGA

12312

320

320

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VFX12-11FFG668C by Xilinx

XC4VFX12-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

12312

320

320

1368

1181 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VFX12-11FFG668I by Xilinx

XC4VFX12-11FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

12312

320

320

1368

1181 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX15-10FFG668C by Xilinx

XC4VLX15-10FFG668C

Xilinx

XC4VLX15-10FFG668C by Xilinx is a FPGA with 13824 logic cells, 1536 CLBs, and 320 inputs/outputs. Operating at max frequency of 1028 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and dimensions of 27mm x 27mm, it offers flexibility in design while maintaining compact form factor.

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX15-10FFG668I by Xilinx

XC4VLX15-10FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA668,26X26,40;

FPGA

13824

320

320

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX15-11FFG668C by Xilinx

XC4VLX15-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX15-12FFG668C by Xilinx

XC4VLX15-12FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

13824

320

320

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX25-10FFG668C by Xilinx

XC4VLX25-10FFG668C

Xilinx

XC4VLX25-10FFG668C by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 448 inputs/outputs. Operating at up to 1028 MHz, it's ideal for high-speed applications like telecommunications equipment and industrial automation systems. With a package style of grid array and dimensions of 27mm x 27mm, it offers flexibility in design while maintaining performance.

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX25-10FFG668I by Xilinx

XC4VLX25-10FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX25-11FFG668C by Xilinx

XC4VLX25-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX25-11FFG668I by Xilinx

XC4VLX25-11FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.14 V;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX25-12FFG668C by Xilinx

XC4VLX25-12FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX40-10FFG668C by Xilinx

XC4VLX40-10FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX40-10FFG668I by Xilinx

XC4VLX40-10FFG668I

Xilinx

XC4VLX40-10FFG668I by Xilinx is a FPGA with 41472 logic cells, 4608 CLBs, and 448 inputs/outputs. Operating at max clock frequency of 1028 MHz, it's ideal for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology and programmable nature.

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX40-11FFG668C by Xilinx

XC4VLX40-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX40-11FFG668I by Xilinx

XC4VLX40-11FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.14 V;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX60-10FFG668C by Xilinx

XC4VLX60-10FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

59904

448

448

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX60-10FFG668I by Xilinx

XC4VLX60-10FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

59904

448

448

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX60-11FFG668C by Xilinx

XC4VLX60-11FFG668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

59904

448

448

6656

1205 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No

XC4VLX60-11FFG668I by Xilinx

XC4VLX60-11FFG668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B668;

FPGA

59904

448

448

6656

1205 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

668

S-PBGA-B668

e1

No