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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU13P-1FSGA2577E by Xilinx

XCVU13P-1FSGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-2FSGA2577E by Xilinx

XCVU13P-2FSGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-2FSGA2577I by Xilinx

XCVU13P-2FSGA2577I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-3FSGA2577E by Xilinx

XCVU13P-3FSGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU27P-2FSGA2577E by Xilinx

XCVU27P-2FSGA2577E

Xilinx

Xilinx XCVU27P-2FSGA2577E FPGA offers 2835000 logic cells, 162000 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating b/w 0-100°C, it's a versatile choice for various industrial and commercial projects.

FPGA

2835000

676

676

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU29P-2FSGA2577E by Xilinx

XCVU29P-2FSGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

676

676

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU29P-3FSGA2577E by Xilinx

XCVU29P-3FSGA2577E

Xilinx

Xilinx XCVU29P-3FSGA2577E FPGA offers 3780000 logic cells, 216000 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V. Suitable for various industries due to its versatility and robust design in a square package style with grid array terminals.

FPGA

3780000

676

676

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU190-2FLGA2577E by Xilinx

XCVU190-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU190-3FLGA2577E by Xilinx

XCVU190-3FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU11P-1FLGA2577E by Xilinx

XCVU11P-1FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-1FLGA2577E by Xilinx

XCVU13P-1FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-1FLGA2577I by Xilinx

XCVU13P-1FLGA2577I

Xilinx

Xilinx XCVU13P-1FLGA2577I FPGA boasts 3.78M logic cells, 216K CLBs, and 832 inputs/outputs. Ideal for industrial applications with a wide operating temperature range (-40 to 100°C) due to its grid array package style and plastic/epoxy material. Suitable for high-performance computing tasks requiring advanced programmable ICs.

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-2FLGA2577I by Xilinx

XCVU13P-2FLGA2577I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-3FLGA2577E by Xilinx

XCVU13P-3FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU9P-1FLGA2577E by Xilinx

XCVU9P-1FLGA2577E

Xilinx

Xilinx XCVU9P-1FLGA2577E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU9P-1FLGA2577I by Xilinx

XCVU9P-1FLGA2577I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU9P-2FLGA2577I by Xilinx

XCVU9P-2FLGA2577I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-2FLGA2577E by Xilinx

XCVU13P-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU9P-2FLGA2577E by Xilinx

XCVU9P-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU29P-2FSGA2577I by Xilinx

XCVU29P-2FSGA2577I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

676

676

216000

216000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.51 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577