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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7VX485T-1FF1927C by Xilinx

XC7VX485T-1FF1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

485760

600

600

1818 MHz

CMOS

Field Programmable Gate Arrays

0.9

.87 V

.93 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1924,44X44,40

Bottom

Ball

Tin/Lead

1 mm

1924

S-PBGA-B1924

e0

No

XC7VX690T-2FF1926I by Xilinx

XC7VX690T-2FF1926I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1818 MHz;

FPGA

693120

720

720

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1924,44X44,40

Bottom

Ball

Tin/Lead

1 mm

1924

S-PBGA-B1924

e0

No

XC7VX690T-2FF1930I by Xilinx

XC7VX690T-2FF1930I

Xilinx

The Xilinx XC7VX690T-2FF1930I FPGA features 693120 logic cells, 1000 inputs/outputs, and a clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs in a square grid array package with CMOS technology.

FPGA

693120

1000

1000

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1924,44X44,40

Bottom

Ball

Tin/Lead

1 mm

1924

S-PBGA-B1924

e0

No

XC7VX980T-1FF1930I by Xilinx

XC7VX980T-1FF1930I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

979200

900

900

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1924,44X44,40

Bottom

Ball

Tin/Lead

1 mm

1924

S-PBGA-B1924

e0

No

XC7VX980T-L2FF1926E by Xilinx

XC7VX980T-L2FF1926E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

979200

720

720

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1924,44X44,40

Bottom

Ball

Tin/Lead

1 mm

1924

S-PBGA-B1924

e0

No

XC6VHX380T-1FFG1924C by Xilinx

XC6VHX380T-1FFG1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XC6VHX380T-2FFG1924I by Xilinx

XC6VHX380T-2FFG1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVD1924C by Xilinx

XCKU115-1FLVD1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVD1924I by Xilinx

XCKU115-1FLVD1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVF1924C by Xilinx

XCKU115-1FLVF1924C

Xilinx

Xilinx XCKU115-1FLVF1924C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithm processing in fields like aerospace, telecommunications, and industrial automation. Package style: grid array with plastic/epoxy material, operating at -40 to 85°C temperature range.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVF1924I by Xilinx

XCKU115-1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVD1924E by Xilinx

XCKU115-2FLVD1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVD1924I by Xilinx

XCKU115-2FLVD1924I

Xilinx

Xilinx XCKU115-2FLVD1924I is a PLASTIC/EPOXY FPGA with 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. It is used in industrial applications requiring high performance and programmable ICs.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVF1924E by Xilinx

XCKU115-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVF1924I by Xilinx

XCKU115-2FLVF1924I

Xilinx

Xilinx XCKU115-2FLVF1924I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C. The device features a grid array package style and is surface mountable for ease of integration.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-3FLVF1924E by Xilinx

XCKU115-3FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-L1FLVF1924I by Xilinx

XCKU115-L1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-2FLVF1924E by Xilinx

XCKU085-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-2FLVF1924I by Xilinx

XCKU085-2FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVF1924I by Xilinx

XCKU085-1FLVF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVF1924C by Xilinx

XCKU085-1FLVF1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCVU11P-2FLGF1924I by Xilinx

XCVU11P-2FLGF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

37320

37320 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.24 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1924

S-PBGA-B1924

XCVU11P-L2FLGF1924E by Xilinx

XCVU11P-L2FLGF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.24 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1924

S-PBGA-B1924