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SoC FPGA Other Function uPs,uCs & Peripheral ICs 10

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
1SX280LN2F43I2VG by Intel

1SX280LN2F43I2VG

Intel

SoC FPGA;

SoC FPGA

MPFS250TL-FCG1152I by Microchip Technology

MPFS250TL-FCG1152I

Microchip Technology

MPFS250TL-FCG1152I by Microchip Technology is a SoC FPGA with 1152 terminals, CMOS technology, and operating temperature range of -40 to 100°C. It is used for various applications requiring high-performance computing in a compact rectangular package suitable for surface mounting.

R-PBGA-B1152

1152

100 Cel

-40 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

CMOS

BALL

BOTTOM

SoC FPGA

AGFA006R16A3E3V by Intel

AGFA006R16A3E3V

Intel

AGFA006R16A3E3V by Intel is a rectangular-shaped SoC FPGA with 1546 terminals. It operates b/w 0°C to 100°C and is surface mountable. This IC is commonly used in various applications requiring other function uPs, uCs, and peripheral integration.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGFA006R16A2E3V by Intel

AGFA006R16A2E3V

Intel

Intel AGFA006R16A2E3V is a SoC FPGA with 1546 terminals, operating from 0 to 100°C. It features plastic/epoxy body material, rectangular shape, and ball terminal form. Ideal for applications requiring high-performance computing in compact designs.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGIB027R31B2I1V by Intel

AGIB027R31B2I1V

Intel

Intel AGIB027R31B2I1V is a SoC FPGA with 3184 terminals, operating from -40 to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs & peripheral ICs due to its high terminal count and temperature range.

R-PBGA-B3184

3184

100 Cel

-40 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGIB027R31B2E3E by Intel

AGIB027R31B2E3E

Intel

Intel AGIB027R31B2E3E is a SoC FPGA with 3184 terminals, operating from 0 to 100°C. It features a plastic/epoxy body, rectangular shape, and surface-mount capability. Ideal for applications requiring high-performance processing and integration in compact designs.

R-PBGA-B3184

3184

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGIB022R31B1E2V by Intel

AGIB022R31B1E2V

Intel

Intel's AGIB022R31B1E2V is a SoC FPGA with 3184 terminals, operating from 0 to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs & peripheral ICs due to its high terminal count and temperature range.

R-PBGA-B3184

3184

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGIB027R31B2I3V by Intel

AGIB027R31B2I3V

Intel

Intel AGIB027R31B2I3V is a SoC FPGA with 3184 terminals, operating from -40 to 100°C. It features a plastic/epoxy package body, rectangular shape, and surface-mount capability. Ideal for applications requiring high-performance computing in harsh environments.

R-PBGA-B3184

3184

100 Cel

-40 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGIB027R31B3E3E by Intel

AGIB027R31B3E3E

Intel

Intel's AGIB027R31B3E3E is a SoC FPGA with 3184 terminals, operating from 0 to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs, and peripheral ICs.

R-PBGA-B3184

3184

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGFA027R24C2E3E by Intel

AGFA027R24C2E3E

Intel

Intel AGFA027R24C2E3E is a SoC FPGA with 2340 terminals, operating from 0°C to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs & peripheral ICs due to its high terminal count and robust design.

R-PBGA-B2340

2340

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA