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2785 Other Function uPs,uCs & Peripheral ICs 24

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVP1502-1LSEVSVA2785 by Xilinx

XCVP1502-1LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2MLEVSVA2785 by Xilinx

XCVP1502-2MLEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-1MSEVSVA2785 by Xilinx

XCVP1502-1MSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-1MSEVSVA2785 by Xilinx

XCVP1202-1MSEVSVA2785

Xilinx

XCVP1202-1MSEVSVA2785 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 2785 terminals in a GRID ARRAY package style, suitable for applications requiring low voltage operation (0.775V to 0.825V) and operating temperatures from 0°C to 100°C.

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LSEVSVA2785 by Xilinx

XCVP1402-1LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1402-2LLEVSVA2785 by Xilinx

XCVP1402-2LLEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-2LSEVSVA2785 by Xilinx

XCVP1202-2LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-3HSEVSVA2785 by Xilinx

XCVP1202-3HSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LSIVSVA2785 by Xilinx

XCVP1402-1LSIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B2785

50 mm

2785

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-2LLEVSVA2785 by Xilinx

XCVP1202-2LLEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1102-1LSEVSVA2785 by Xilinx

XCVP1102-1LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2785;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1102-1LSIVSVA2785 by Xilinx

XCVP1102-1LSIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4.48 mm;

S-PBGA-B2785

50 mm

2785

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1102-2LLEVSVA2785 by Xilinx

XCVP1102-2LLEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1102-1LLIVSVA2785 by Xilinx

XCVP1102-1LLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;

S-PBGA-B2785

50 mm

2785

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2LSEVSVA2785 by Xilinx

XCVP1502-2LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4.48 mm;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2MSEVSVA2785 by Xilinx

XCVP1502-2MSEVSVA2785

Xilinx

XCVP1502-2MSEVSVA2785 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C and has 0.775-0.825 V supply voltage range. With 2785 terminals in a GRID ARRAY package, it's ideal for advanced electronic applications.

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-2MLEVSVA2785 by Xilinx

XCVP1202-2MLEVSVA2785

Xilinx

XCVP1202-2MLEVSVA2785 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 2785 terminals in a GRID ARRAY package style, suitable for applications requiring low voltage operation (0.775V to 0.825V) and operating temperatures up to 110°C.

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LLIVSVA2785 by Xilinx

XCVP1402-1LLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Length: 50 mm;

S-PBGA-B2785

50 mm

2785

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1402-2LSEVSVA2785 by Xilinx

XCVP1402-2LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-3HSEVSVA2785 by Xilinx

XCVP1502-3HSEVSVA2785

Xilinx

XCVP1502-3HSEVSVA2785 by Xilinx is a MICROPROCESSOR CIRCUIT with 2785 terminals in a GRID ARRAY package. It operates b/w 0-100 °C with supply voltage range of 0.854-0.906 V, making it ideal for high-performance computing applications. The CMOS technology and BALL terminal form ensure efficient processing and connectivity in compact spaces.

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1102-2LSEVSVA2785 by Xilinx

XCVP1102-2LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2LLEVSVA2785 by Xilinx

XCVP1502-2LLEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-1LSEVSVA2785 by Xilinx

XCVP1202-1LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2785;

S-PBGA-B2785

50 mm

2785

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

XCVP1202-2MSEVSVA2785 by Xilinx

XCVP1202-2MSEVSVA2785

Xilinx

XCVP1202-2MSEVSVA2785 by Xilinx is a MICROPROCESSOR CIRCUIT with 2785 terminals in a GRID ARRAY package. It operates b/w 0-110 °C with supply voltage range of 0.775-0.825 V. Ideal for applications requiring high-performance CMOS technology and compact design.

S-PBGA-B2785

50 mm

2785

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA2785,53X53,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT