Loading...

256 Other Function uPs,uCs & Peripheral ICs 3

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XOMAPL137AZKB3 by Texas Instruments

XOMAPL137AZKB3

Texas Instruments

XOMAPL137AZKB3 by Texas Instruments is a 256-terminal IC with power supplies of 1.2V, 1.8/3.3V, operating b/w 0-70°C. It features a square package shape made of plastic/epoxy material and is surface mountable. Ideal for commercial applications requiring high-performance microcontrollers and peripheral functions in a compact grid array package style.

S-PBGA-B256

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.2,1.8/3.3

Not Qualified

Other Microprocessor ICs

YES

COMMERCIAL

BALL

1 mm

BOTTOM

LH7A400N0E000B3A by NXP Semiconductors

LH7A400N0E000B3A

NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

S-XBGA-B256

256

70 Cel

0 Cel

CERAMIC

FBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

OSD3358-1G-ISM by Octavo Systems

OSD3358-1G-ISM

Octavo Systems

Octavo Systems' OSD3358-1G-ISM is a 256-terminal SoC with CMOS technology, operating b/w -40°C to 85°C. Its grid array package style and 1.27mm terminal pitch make it suitable for compact embedded systems requiring low power consumption and high processing capabilities. Ideal for IoT devices, robotics, and industrial automation applications.

S-PBGA-B256

21 mm

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,50

SQUARE

GRID ARRAY

2.58 mm

1.1 V

YES

CMOS

BALL

1.27 mm

BOTTOM

21 mm

SoC