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625 Multi-functional Peripherals 7

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
M86261G12 by NXP Semiconductors

M86261G12

NXP Semiconductors

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

I2C, PCI, SPI, UART, USB

650 MHz

32

S-PBGA-B625

21 mm

3

64

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

32768

2.67 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

LS1024ASN7ELA by NXP Semiconductors

LS1024ASN7ELA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

650 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1200 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7MLA by NXP Semiconductors

LS1024ASE7MLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

1200 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1500 mA

1.164 V

1.096 V

1.13 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7ELA by NXP Semiconductors

LS1024ASE7ELA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

650 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1200 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASN7MLA by NXP Semiconductors

LS1024ASN7MLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

1200 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1500 mA

1.164 V

1.096 V

1.13 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASN7JLA by NXP Semiconductors

LS1024ASN7JLA

NXP Semiconductors

LS1024ASN7JLA by NXP Semiconductors is a multi-functional peripheral IC with 625 terminals, operating at up to 900 MHz clock frequency. It features a CMOS technology, 26-bit address bus width, and supports boundary scan. Ideal for commercial applications requiring high-speed data processing in compact electronic devices.

26

YES

900 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1400 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7JLA by NXP Semiconductors

LS1024ASE7JLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

900 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1400 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL