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36 Multi-functional Peripherals 7

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
BTS6460SFXUMA1 by Infineon Technologies

BTS6460SFXUMA1

Infineon Technologies

Multifunction Peripherals; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;

0

NO

0

R-PDSO-G36

12.8 mm

0

36

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NOT SPECIFIED

2.65 mm

5.5 V

3 V

5 V

YES

CMOS

GULL WING

.65 mm

DUAL

NOT SPECIFIED

7.6 mm

CC1111F16RSPR by Texas Instruments

CC1111F16RSPR

Texas Instruments

The Texas Instruments CC1111F16RSPR is a CMOS chip carrier with 36 terminals in a square package. It features nickel palladium gold terminal finish, 0.5mm pitch, and 0.9mm seated height. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F16RSP by Texas Instruments

CC1111F16RSP

Texas Instruments

The Texas Instruments CC1111F16RSP is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It can withstand peak reflow temperatures of 260°C for up to 30 seconds. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F32RSP by Texas Instruments

CC1111F32RSP

Texas Instruments

CC1111F32RSP by Texas Instruments is a 8051 CPU family chip carrier with 4096 RAM bytes. It features 21 I/O lines, operates b/w 0-85°C, and has a terminal pitch of 0.5mm. Ideal for applications requiring multi-functional peripherals in compact spaces.

8051

S-PQCC-N36

e4

6 mm

3

21

36

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

4096

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F8RSPR by Texas Instruments

CC1111F8RSPR

Texas Instruments

The Texas Instruments CC1111F8RSPR is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It features nickel palladium gold finish and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for applications requiring multi-functional peripherals in compact spaces.

S-XQCC-N36

e4

6 mm

3

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1111F8RSP by Texas Instruments

CC1111F8RSP

Texas Instruments

Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

8051

S-PQCC-N36

e4

6 mm

3

21

36

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

4096

.9 mm

YES

CMOS

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

BTS5460SFXUMA1 by Infineon Technologies

BTS5460SFXUMA1

Infineon Technologies

Multifunction Peripherals; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

0

NO

0

R-PDSO-G36

12.8 mm

36

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NOT SPECIFIED

2.65 mm

5.5 V

3 V

5 V

YES

CMOS

GULL WING

.65 mm

DUAL

NOT SPECIFIED

7.6 mm