SoC Microprocessors 6

Part# Info			Specs
Part	RoHS	Manufacturer	Description	ADC Channels	Additional Features	Address Bus Width	Bit Size	Boundary Scan	Bus Compatibility	CPU Family	Maximum Clock Frequency	DAC Channels	DMA Channels	External Data Bus Width	Format	Integrated Cache	JESD-30 Code	JESD-609 Code	Length	Low Power Mode	Moisture Sensitivity Level (MSL)	No. of DMA Channels	No. of External Interrupts	No. of I/O Lines	No. of Serial I/Os	No. of Terminals	On Chip Data RAM Width	On Chip Program ROM Width	Maximum Operating Temperature	Minimum Operating Temperature	PWM Channels	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style (Meter)	Peak Reflow Temperature (C)	Power Supplies (V)	Qualification	RAM Bytes	RAM Words	ROM Words	ROM Programmability	Screening Level	Maximum Seated Height	Speed	Sub-Category	Maximum Supply Current	Maximum Supply Voltage	Minimum Supply Voltage	Nominal Supply Voltage	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Maximum Time At Peak Reflow Temperature (s)	Total Dose (V)	Width	Peripheral IC Type	Data EEPROM Size	Connectivity	Peripherals	Analog To Digital Convertors
LS1043ASE7KQB		NXP Semiconductors	SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;		ALSO OPERATES AT 1V NOMINAL SUPPLY	16	64	YES						32	FIXED POINT	YES	S-PBGA-B621	e1	21 mm	YES	3					621			105 Cel	0 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1000 rpm			.93 V	.87 V	.9 V	YES	CMOS	OTHER	TIN SILVER COPPER	BALL	.8 mm	BOTTOM	30		21 mm	SoC
LS1043ASE7PQB		NXP Semiconductors	SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;		ALSO OPERATES AT 1V NOMINAL SUPPLY	16	64	YES						32	FIXED POINT	YES	S-PBGA-B621	e1	21 mm	YES	3					621			105 Cel	0 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1400 rpm			.93 V	.87 V	.9 V	YES	CMOS	OTHER	TIN SILVER COPPER	BALL	.8 mm	BOTTOM	30		21 mm	SoC
LS1043ASE7QQB		NXP Semiconductors	SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;		ALSO OPERATES AT 1V NOMINAL SUPPLY	16	64	YES						32	FIXED POINT	YES	S-PBGA-B621	e1	21 mm	YES	3					621			105 Cel	0 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1600 rpm			.93 V	.87 V	.9 V	YES	CMOS	OTHER	TIN SILVER COPPER	BALL	.8 mm	BOTTOM	30		21 mm	SoC
LS1043ASE8PQB		NXP Semiconductors	LS1043ASE8PQB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 32-bit external data bus width, and low power mode. It is used in System on Chip (SoC) applications for high-speed processing at temperatures up to 105°C.		ALSO OPERATES AT 1V NOMINAL SUPPLY	14	64	YES						32	FIXED POINT	YES	S-PBGA-B780	e1	23 mm	YES	3					780			105 Cel	0 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1400 rpm			.93 V	.87 V	.9 V	YES	CMOS	OTHER	TIN SILVER COPPER	BALL	.8 mm	BOTTOM	30		23 mm	SoC
LS1043ASN8MQB		NXP Semiconductors	SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;		ALSO OPERATES AT 1V NOMINAL SUPPLY	14	64	YES						32	FIXED POINT	YES	S-PBGA-B780		23 mm	YES	3					780			105 Cel	0 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1200 rpm			.93 V	.87 V	.9 V	YES	CMOS	OTHER		BALL	.8 mm	BOTTOM	30		23 mm	SoC
LS1043AXE7QQB		NXP Semiconductors	SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;		ALSO OPERATES AT 1V NOMINAL SUPPLY	16	64	YES						32	FIXED POINT	YES	S-PBGA-B621	e1	21 mm	YES	3					621			105 Cel	-40 Cel		PLASTIC/EPOXY	FBGA		SQUARE	GRID ARRAY, FINE PITCH	250								2.07 mm	1600 rpm			.93 V	.87 V	.9 V	YES	CMOS	INDUSTRIAL	TIN SILVER COPPER	BALL	.8 mm	BOTTOM	30		21 mm	SoC