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425 Microprocessors 12

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
P1014NSN5FFA,557 by NXP Semiconductors

P1014NSN5FFA,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;

0

32

YES

100 MHz

0

FLOATING POINT

YES

S-PBGA-B425

19 mm

YES

425

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR, RISC

P1010NSN5HFB by NXP Semiconductors

P1010NSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5FFB by NXP Semiconductors

P1010NXE5FFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5KHB by NXP Semiconductors

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5HFB by NXP Semiconductors

P1010NXE5HFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5KHB by NXP Semiconductors

P1010NXE5KHB

NXP Semiconductors

The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5FFB by NXP Semiconductors

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSE5FFB by NXP Semiconductors

P1010NSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5DFB by NXP Semiconductors

P1010NSN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5FFB by NXP Semiconductors

P1010NSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5KHB by NXP Semiconductors

P1010NSN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5DFB by NXP Semiconductors

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC