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1517 Microprocessors 73

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LX2120XN72232B by NXP Semiconductors

LX2120XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE72232B by NXP Semiconductors

LX2160SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN71826B by NXP Semiconductors

LX2160SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC71826B by NXP Semiconductors

LX2160XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC71826B by NXP Semiconductors

LX2160SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE71826B by NXP Semiconductors

LX2160SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SE72029B by NXP Semiconductors

LX2160SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN72029B by NXP Semiconductors

LX2160SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SN72232B by NXP Semiconductors

LX2160SN72232B

NXP Semiconductors

The NXP Semiconductors LX2160SN72232B is a 64-bit microprocessor with 36-bit address bus width and 128-bit external data bus width. It operates at speeds up to 2200 rpm, suitable for low power mode applications. With integrated cache and 12 external interrupts, it's ideal for high-performance computing in various industries.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72232B by NXP Semiconductors

LX2160XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN71826B by NXP Semiconductors

LX2160XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72232B by NXP Semiconductors

LX2160XN72232B

NXP Semiconductors

The NXP Semiconductors LX2160XN72232B microprocessor features a 64-bit architecture, 128-bit external data bus width, and 36-bit address bus width. Ideal for industrial applications requiring high-speed processing and low power consumption.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SC71826B by NXP Semiconductors

LX2080SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SE72232B by NXP Semiconductors

LX2080SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72232B by NXP Semiconductors

LX2080XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72029B by NXP Semiconductors

LX2080XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN71826B by NXP Semiconductors

LX2080XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC72029B by NXP Semiconductors

LX2120SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC72232B by NXP Semiconductors

LX2120SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC71826B by NXP Semiconductors

LX2120XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72232B by NXP Semiconductors

LX2120XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72232B by NXP Semiconductors

LX2120XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72029B by NXP Semiconductors

LX2160XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72232B by NXP Semiconductors

LX2160XC72232B

NXP Semiconductors

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72029B by NXP Semiconductors

LX2160XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC