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HBGA Bus Controllers 12

Bus Controllers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Bus Compatibility Maximum Clock Frequency DAC Channels DMA Channels Maximum Data Transfer Rate Drive Interface Standard External Data Bus Width JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Bits No. of I/O Lines No. of Terminals On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals
PEX8696-AA50RBCG by Broadcom

PEX8696-AA50RBCG

Broadcom

BUS CONTROLLER, PCI; Terminal Form: BALL; No. of Terminals: 1156; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 0;

0

I2C, SMBUS, SPI, USB

250 MHz

.0125 MBps

0

S-PBGA-B1156

35 mm

1156

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1156,34X34,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.85 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

BUS CONTROLLER, PCI

PEX8625-AA50RBCF by Broadcom

PEX8625-AA50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: HBGA; Package Shape: SQUARE;

0

I2C; SMBUS; SPI; VGA

.0125 MBps

IEEE 1149.6; IEEE 1149.1

0

S-PBGA-B1156

35 mm

4

1156

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1156,34X34,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.85 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

35 mm

BUS CONTROLLER, PCI

PEX8616-BB50RBCF by Broadcom

PEX8616-BB50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE;

I2C; ISA; SMBUS; SPI; VGA

IEEE 1149.1; IEEE 1149.6

S-PBGA-B324

e1

19 mm

4

324

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA324,18X18,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.48 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

19 mm

BUS CONTROLLER, PCI

PEX8612-BB50RBCF by Broadcom

PEX8612-BB50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE;

0

I2C; SMBUS; SPI; USB

IEEE 1149.6; IEEE 1149.1

0

S-PBGA-B324

e1

19 mm

4

324

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.48 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

19 mm

BUS CONTROLLER, PCI

PEX8647-BB50RBCF by Broadcom

PEX8647-BB50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: HBGA; Package Shape: SQUARE;

0

I2C; SMBUS; SPI; USB

IEEE 1149.6; IEEE 1149.1

0

S-PBGA-B676

27 mm

676

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.48 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

BUS CONTROLLER, PCI

PEX8649-AA50RBCF by Broadcom

PEX8649-AA50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: HBGA; Package Shape: SQUARE;

0

I2C; SMBUS; SPI; USB

.0125 MBps

IEEE 1149.6; IEEE 1149.1

0

S-PBGA-B676

e1

27 mm

4

676

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA676,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.48 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

27 mm

BUS CONTROLLER, PCI

PEX8696-AA50RBCF by Broadcom

PEX8696-AA50RBCF

Broadcom

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: HBGA; Package Shape: SQUARE;

0

I2C; SMBUS; SPI; USB

.0125 MBps

IEEE 1149.6; IEEE 1149.1

0

S-PBGA-B1156

e1

35 mm

4

1156

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1156,34X34,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.85 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

35 mm

BUS CONTROLLER, PCI

PI7C9X2G1616PRBHSBE by Diodes Incorporated

PI7C9X2G1616PRBHSBE

Diodes Incorporated

Diodes Inc. PI7C9X2G1616PRBHSBE is a Bus Controller IC with 324 terminals, operating at -40 to 85°C. It supports I2C, PCI, SMBus buses with a max clock frequency of 100MHz and data rate of 625MBps. Ideal for applications requiring high-speed data transfer in compact spaces.

0

I2C, PCI, SMBUS

100 MHz

625 MBps

0

S-PBGA-B324

19 mm

324

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA324,18X18,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

1.9 mm

1.1 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

19 mm

BUS CONTROLLER, PCI

PI7C9X2G1224GPBHSBE by Diodes Incorporated

PI7C9X2G1224GPBHSBE

Diodes Incorporated

Diodes Inc. PI7C9X2G1224GPBHSBE is a Bus Controller IC with 324 terminals, operating at -40 to 85°C. It supports I2C, PCI, SMBus buses with a clock frequency of 100MHz and data rate of 625MBps. This CMOS technology chip in grid array package is ideal for high-speed data transfer applications.

0

I2C, PCI, SMBUS

100 MHz

625 MBps

0

S-PBGA-B324

19 mm

324

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA324,18X18,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

1.9 mm

1.1 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

19 mm

BUS CONTROLLER, PCI

PI7C9X3G816GPBHFCE by Diodes Incorporated

PI7C9X3G816GPBHFCE

Diodes Incorporated

Diodes Inc. PI7C9X3G816GPBHFCE is a PCI bus controller IC with 324 terminals in a grid array package. It operates at 100MHz clock frequency, supports I2C and SPI buses, and has a max data transfer rate of 0.0125MBps. Ideal for applications requiring high-speed data processing on compact PCBs.

0

I2C, SPI

100 MHz

.0125 MBps

0

S-PBGA-B324

19 mm

324

PLASTIC/EPOXY

HBGA

BGA324,18X18,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.89 mm

.99 V

.9 V

.95 V

YES

CMOS

BALL

1 mm

BOTTOM

19 mm

BUS CONTROLLER, PCI

PEX8680-AA50RBCG by Broadcom

PEX8680-AA50RBCG

Broadcom

BUS CONTROLLER, PCI; Terminal Form: BALL; No. of Terminals: 1156; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 0;

0

I2C, PCI, SMBUS

250 MHz

0

S-PBGA-B1156

35 mm

1156

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1156,34X34,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.85 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

BUS CONTROLLER, PCI

PEX8680-AA50RBCF by Broadcom

PEX8680-AA50RBCF

Broadcom

BUS CONTROLLER, PCI; Terminal Form: BALL; No. of Terminals: 1156; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

0

I2C, PCI, SMBUS

250 MHz

0

S-PBGA-B1156

35 mm

4

1156

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1156,34X34,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.85 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

BUS CONTROLLER, PCI