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VFBGA Other Function Memory ICs 23

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
MT29C4G48MAZAPAKQ-5IT by Micron Technology

MT29C4G48MAZAPAKQ-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

S-PBGA-B168

e1

12 mm

2097152 bit

MEMORY CIRCUIT

16

FLASH+SDRAM

1

168

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.75 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

12 mm

MT29C4G96MAZBBCJV-48IT by Micron Technology

MT29C4G96MAZBBCJV-48IT

Micron Technology

MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Package Body Material: PLASTIC/EPOXY;

IT IS ALSO HAVING 4GBIT (X 32) LPDDR

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

FLASH+LPDDR

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX16

PLASTIC/EPOXY

VFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

BALL

.5 mm

BOTTOM

12 mm

MT29C4G48MAZBBAKB-48IT by Micron Technology

MT29C4G48MAZBBAKB-48IT

Micron Technology

Micron Technology's MT29C4G48MAZBBAKB-48IT is a 256MX16 FLASH+LPDDR memory IC with 4294967296 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in compact devices with limited space and power constraints.

IT IS ALSO HAVING 2GBIT (X 32) LPDDR

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

FLASH+LPDDR

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX16

PLASTIC/EPOXY

VFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.8 mm

1.95 V

1.7 V

1.8

YES

CMOS

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C8G96MAZBBDJV-48IT by Micron Technology

MT29C8G96MAZBBDJV-48IT

Micron Technology

MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Additional Features: IT IS ALSO HAVING 4GBIT (X 32) LPDDR;

IT IS ALSO HAVING 4GBIT (X 32) LPDDR

S-PBGA-B168

12 mm

8589934592 bit

MEMORY CIRCUIT

16

FLASH+LPDDR

1

168

536870912 words

512M

SYNCHRONOUS

85 Cel

-40 Cel

512MX16

PLASTIC/EPOXY

VFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

M39L0R8090U3ZE6E by Micron Technology

M39L0R8090U3ZE6E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B133

8 mm

536870912 bit

MEMORY CIRCUIT

16

1

133

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C4G48MAYBBAHK-48AIT by Micron Technology

MT29C4G48MAYBBAHK-48AIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B137;

IT IS ALSO HAVING 2GBIT (X 32) LPDDR

R-PBGA-B137

e1

13 mm

4294967296 bit

MEMORY CIRCUIT

8

1

137

536870912 words

512M

SYNCHRONOUS

85 Cel

-40 Cel

512MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

10.5 mm

MT29C1G12MAAIVAMD-5IT by Micron Technology

MT29C1G12MAAIVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

IT ALSO CONTAINS 512MBIT(32MBIT X 16) MOBILE LPDDR

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAIYAMR-5AIT by Micron Technology

MT29C1G12MAAIYAMR-5AIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B130;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAJVAMD-5IT by Micron Technology

MT29C1G12MAAJVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Width: 8 mm;

IT ALSO CONTAINS 512MBIT(32MBIT X 16) MOBILE LPDDR

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

16

1

130

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C1G12MAAJYAMD-5IT by Micron Technology

MT29C1G12MAAJYAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

16

1

130

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C2G24MAAAAHAMD-5IT by Micron Technology

MT29C2G24MAAAAHAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C2G24MAABAHAMD-5EIT by Micron Technology

MT29C2G24MAABAHAMD-5EIT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Additional Features: ALSO ORGANISED AS 64M X 16;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

8 mm

MT29C2G24MAABAHAMD-5IT by Micron Technology

MT29C2G24MAABAHAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm

MT29C2G24MAABAKAMD-5IT by Micron Technology

MT29C2G24MAABAKAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 32;

ALSO ORGANISED AS 64M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

32

1

130

33554432 words

32M

SYNCHRONOUS

85 Cel

-40 Cel

32MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

8 mm

MT29C4G48MAZBAAKS-5WT by Micron Technology

MT29C4G48MAZBAAKS-5WT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

ALSO ORGANISED AS 128M X 16

R-PBGA-B137

13 mm

2147483648 bit

MEMORY CIRCUIT

32

1

137

67108864 words

64M

SYNCHRONOUS

85 Cel

-25 Cel

64MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

MT29C1G12MAACVAMD-5IT by Micron Technology

MT29C1G12MAACVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

MT29C1G12MAACYAMD-5IT by Micron Technology

MT29C1G12MAACYAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

MT29C1G12MAADVAMD-5IT by Micron Technology

MT29C1G12MAADVAMD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

NAND FLASH IS ORGANISED AS 64M X 16

R-PBGA-B130

e1

9 mm

536870912 bit

MEMORY CIRCUIT

32

1

130

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

30

8 mm

MT29C4G96MAZBACJG-5WT by Micron Technology

MT29C4G96MAZBACJG-5WT

Micron Technology

MT29C4G96MAZBACJG-5WT by Micron Technology is a 256MX16 Synchronous Flash+SDRAM memory IC with 4294967296 bit density. Operating at 1.8V, it offers a max access time of 25ns and is ideal for applications requiring high-speed data processing in compact electronic devices.

25 ns

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

FLASH+SDRAM

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-25 Cel

256MX16

PLASTIC/EPOXY

VFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.8

Not Qualified

.9 mm

Other Memory ICs

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C4G48MAZBAAKQ-5WT by Micron Technology

MT29C4G48MAZBAAKQ-5WT

Micron Technology

Micron Technology's MT29C4G48MAZBAAKQ-5WT is a 256MX16 memory IC with 4294967296-bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in compact devices with very thin profile and fine pitch package style.

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-25 Cel

256MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.75 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C4G96MAZBACJG-5IT by Micron Technology

MT29C4G96MAZBACJG-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX16;

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

4294967296 bit

MEMORY CIRCUIT

16

1

168

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.9 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C8G96MAZBADJV-5IT by Micron Technology

MT29C8G96MAZBADJV-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;

MOBILE LPDDR DEVICE ALSO AVAILABLE

S-PBGA-B168

12 mm

8589934592 bit

MEMORY CIRCUIT

16

1

168

536870912 words

512M

SYNCHRONOUS

85 Cel

-40 Cel

512MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MT29C1G12MAAIVAMD-5ITTR by Micron Technology

MT29C1G12MAAIVAMD-5ITTR

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;

LPDRAM IS ORGANISED AS 32M X 16

R-PBGA-B130

9 mm

1073741824 bit

MEMORY CIRCUIT

8

1

130

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

8 mm