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TFBGA Other Function Memory ICs 6

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
MT29C2G48MAKLCJI-6IT by Micron Technology

MT29C2G48MAKLCJI-6IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: TFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;

S-PBGA-B168

e1

12 mm

2097152 bit

MEMORY CIRCUIT

16

FLASH+SDRAM

1

168

131072 words

128K

ASYNCHRONOUS

85 Cel

-40 Cel

128KX16

PLASTIC/EPOXY

TFBGA

BGA168,23X23,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8

Not Qualified

1.1 mm

Other Memory ICs

1.95 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

12 mm

MT29C4G96MAYBACKD-5WT by Micron Technology

MT29C4G96MAYBACKD-5WT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 67108864 words;

ALSO ORGANISED AS 128M X 16

R-PBGA-B137

13 mm

2147483648 bit

MEMORY CIRCUIT

32

1

137

67108864 words

64M

SYNCHRONOUS

85 Cel

-25 Cel

64MX32

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.1 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

MT29C4G96MAZBACKD-5WT by Micron Technology

MT29C4G96MAZBACKD-5WT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 10.5 mm;

ALSO ORGANISED AS 128M X 16

R-PBGA-B137

13 mm

2147483648 bit

MEMORY CIRCUIT

32

1

137

67108864 words

64M

SYNCHRONOUS

85 Cel

-25 Cel

64MX32

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.1 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

MT29C8G96MAZBADKD-5IT by Micron Technology

MT29C8G96MAZBADKD-5IT

Micron Technology

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

ALSO ORGANISED AS 128M X 16

R-PBGA-B137

13 mm

2147483648 bit

MEMORY CIRCUIT

32

1

137

67108864 words

64M

SYNCHRONOUS

85 Cel

-25 Cel

64MX32

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.1 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

MT29C8G96MAZBADKD-5WT by Micron Technology

MT29C8G96MAZBADKD-5WT

Micron Technology

MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.

ALSO ORGANISED AS 128M X 16

R-PBGA-B137

13 mm

2147483648 bit

MEMORY CIRCUIT

32

1

137

67108864 words

64M

SYNCHRONOUS

85 Cel

-25 Cel

64MX32

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.1 mm

1.95 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

EMD3D256M08G1-150CBS1R by Everspin Technologies

EMD3D256M08G1-150CBS1R

Everspin Technologies

EMD3D256M08G1-150CBS1R by Everspin: 32MX8 memory IC with 268MB density, operates at 1.5V, synchronous mode. Ideal for applications requiring high-speed and reliable memory storage in compact devices.

R-PBGA-B78

13 mm

268435456 bit

MEMORY CIRCUIT

8

1

78

33554432 words

32M

SYNCHRONOUS

85 Cel

0 Cel

32MX8

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.575 V

1.425 V

1.5

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm