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BGA Other Function Memory ICs 19

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
XCCACEM16BG388I by Xilinx

XCCACEM16BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL;

20

1000000 Write/Erase Cycles

S-PBGA-B388

35 mm

16777216 bit

MEMORY CIRCUIT

16

1

1

388

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm

XCCACEM32BG388I by Xilinx

XCCACEM32BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

20

1000000 Write/Erase Cycles

S-PBGA-B388

e0

35 mm

33554432 bit

MEMORY CIRCUIT

16

1

1

388

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm

XCCACEM64BG388I by Xilinx

XCCACEM64BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

133 MHz

1000000 Write/Erase Cycles

S-PBGA-B388

e0

35 mm

67108864 bit

MEMORY CIRCUIT

16

1

388

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm

THGBMGG9U4LBAIR by Toshiba

THGBMGG9U4LBAIR

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

85 Cel

-25 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMGT0U8LBAIG by Toshiba

THGBMGT0U8LBAIG

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

R-PBGA-B153

1099511627776 bit

MEMORY CIRCUIT

8

1

153

137438953472 words

128G

85 Cel

-25 Cel

128GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG6C1LBAIL by Toshiba

THGBMHG6C1LBAIL

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

R-PBGA-B153

68719476736 bit

MEMORY CIRCUIT

8

1

153

8589934592 words

8G

85 Cel

-25 Cel

8GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG6C1LBAU6 by Toshiba

THGBMHG6C1LBAU6

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PBGA-B153

68719476736 bit

MEMORY CIRCUIT

8

1

153

8589934592 words

8G

105 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG7C1LBAIL by Toshiba

THGBMHG7C1LBAIL

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

R-PBGA-B153

137438953472 bit

MEMORY CIRCUIT

8

1

153

17179869184 words

16G

85 Cel

-25 Cel

16GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG7C2LBAU7 by Toshiba

THGBMHG7C2LBAU7

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

R-PBGA-B153

137438953472 bit

MEMORY CIRCUIT

8

1

153

17179869184 words

16G

105 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG8C2LBAIL by Toshiba

THGBMHG8C2LBAIL

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 8;

R-PBGA-B153

274877906944 bit

MEMORY CIRCUIT

8

1

153

34359738368 words

32G

85 Cel

-25 Cel

32GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG8C4LBAU7 by Toshiba

THGBMHG8C4LBAU7

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

R-PBGA-B153

274877906944 bit

MEMORY CIRCUIT

8

1

153

34359738368 words

32G

105 Cel

-40 Cel

32GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG9C4LBAIR by Toshiba

THGBMHG9C4LBAIR

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

85 Cel

-25 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG9C8LBAU8 by Toshiba

THGBMHG9C8LBAU8

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

105 Cel

-40 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHT0C8LBAIG by Toshiba

THGBMHT0C8LBAIG

Toshiba

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

R-PBGA-B153

1099511627776 bit

MEMORY CIRCUIT

8

1

153

137438953472 words

128G

85 Cel

-25 Cel

128GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

THGBMHG6C1LBAWL by Toshiba

THGBMHG6C1LBAWL

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;

R-PBGA-B153

68719476736 bit

MEMORY CIRCUIT

8

1

153

8589934592 words

8G

ASYNCHRONOUS

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG7C2LBAWR by Toshiba

THGBMHG7C2LBAWR

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PBGA-B153

137438953472 bit

MEMORY CIRCUIT

8

1

153

17179869184 words

16G

ASYNCHRONOUS

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG8C4LBAWR by Toshiba

THGBMHG8C4LBAWR

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PBGA-B153

274877906944 bit

MEMORY CIRCUIT

8

1

153

34359738368 words

32G

ASYNCHRONOUS

85 Cel

-40 Cel

32GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

THGBMHG9C8LBAWG by Toshiba

THGBMHG9C8LBAWG

Toshiba

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;

R-PBGA-B153

549755813888 bit

MEMORY CIRCUIT

8

1

153

68719476736 words

64G

ASYNCHRONOUS

85 Cel

-40 Cel

64GX8

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MT43A4G40200NFA-S15:A by Micron Technology

MT43A4G40200NFA-S15:A

Micron Technology

Micron Technology's MT43A4G40200NFA-S15:A is a 4GX4 memory IC with 17179869184 bit density. Operating at 1.2V, it features synchronous mode and 896 terminals in a square GRID ARRAY package. Ideal for applications requiring high memory capacity and fast data processing in electronic devices.

IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE

S-PBGA-B896

31 mm

17179869184 bit

MEMORY CIRCUIT

4

1

896

4294967296 words

4G

SYNCHRONOUS

105 Cel

0 Cel

4GX4

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

4.2 mm

1.26 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

31 mm