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Infineon Technologies FRAMs 23

FRAMs
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Maximum Clock Frequency (fCLK) Minimum Data Retention Time Endurance JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Write Protection
CY15B128Q-SXET by Infineon Technologies

CY15B128Q-SXET

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Technology: CMOS; Endurance: 10000000000000 Write/Erase Cycles;

2kv ESD available

33 MHz

38

10000000000000 Write/Erase Cycles

R-PDSO-G8

4.889 mm

131072 bit

FRAM

8

1

8

16384 words

16K

SYNCHRONOUS

125 Cel

-40 Cel

16KX8

PLASTIC/EPOXY

SOP

SOP8,.25

SQUARE

SMALL OUTLINE

SERIAL

AEC-Q100

1.727 mm

SPI

.0005 Amp

2.7 V

5 mA

3.6 V

2.7 V

3.3

YES

CMOS

GULL WING

1.27 mm

DUAL

3.8985 mm

HARDWARE/SOFTWARE

CY15E064J-SXE by Infineon Technologies

CY15E064J-SXE

Infineon Technologies

Infineon's CY15E064J-SXE FRAM features 8Kx8 organization, 1MHz clock frequency, and 10000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with a serial I2C interface in automotive electronics due to AEC-Q100 screening level.

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

1 MHz

11

10000000000000 Write/Erase Cycles

R-PDSO-G8

4.889 mm

65536 bit

FRAM

8

3

1

8

8192 words

8K

SYNCHRONOUS

125 Cel

-40 Cel

8KX8

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

AEC-Q100

1.727 mm

I2C

.00004 Amp

4.5 V

.45 mA

5.5 V

4.5 V

5

YES

CMOS

GULL WING

1.27 mm

DUAL

3.8985 mm

HARDWARE

CY15B102QM-50SWXI by Infineon Technologies

CY15B102QM-50SWXI

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: SPI; Parallel or Serial: SERIAL;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PDSO-G8

4.889 mm

2097152 bit

FRAM

8

3

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

1.727 mm

SPI

.00007 Amp

1.8 V

3.7 mA

3.6 V

1.8 V

3.3

YES

CMOS

GULL WING

1.27 mm

DUAL

3.8985 mm

HARDWARE/SOFTWARE

CY15B102QM-50SWXIT by Infineon Technologies

CY15B102QM-50SWXIT

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Equivalence Code: SOP8,.25;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PDSO-G8

4.889 mm

2097152 bit

FRAM

8

3

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

1.727 mm

SPI

.00007 Amp

1.8 V

3.7 mA

3.6 V

1.8 V

3.3

YES

CMOS

GULL WING

1.27 mm

DUAL

3.8985 mm

HARDWARE/SOFTWARE

CY15B101N-ZS60XM by Infineon Technologies

CY15B101N-ZS60XM

Infineon Technologies

FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL; Terminal Pitch: .8 mm;

60 ns

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE

11

10000000000000 Write/Erase Cycles

R-PDSO-G44

18.415 mm

1048576 bit

FRAM

16

3

1

44

65536 words

64K

ASYNCHRONOUS

125 Cel

-55 Cel

64KX16

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

1.194 mm

.0007 Amp

2 V

20 mA

3.6 V

2 V

3.3

YES

CMOS

GULL WING

.8 mm

DUAL

10.16 mm

CY15B102N-ZS60XM by Infineon Technologies

CY15B102N-ZS60XM

Infineon Technologies

Infineon's CY15B102N-ZS60XM FRAM features 128KX16 organization, 3.3V supply voltage, and 10000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with fast access times in a compact small outline package.

60 ns

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

11

10000000000000 Write/Erase Cycles

R-XDSO-G44

18.415 mm

2097152 bit

FRAM

16

1

44

131072 words

128K

ASYNCHRONOUS

125 Cel

-55 Cel

128KX16

UNSPECIFIED

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

1.194 mm

.0007 Amp

2 V

20 mA

3.6 V

2 V

3.3

YES

CMOS

GULL WING

.8 mm

DUAL

10.16 mm

SOFTWARE

CY15B102QN-50LHXIT by Infineon Technologies

CY15B102QN-50LHXIT

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Maximum Supply Voltage (Vsup): 3.6 V;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PDSO-N8

6 mm

2097152 bit

FRAM

8

3

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

.8 mm

SPI

.00007 Amp

1.8 V

3.7 mA

3.6 V

1.8 V

3.3

YES

CMOS

NO LEAD

1.27 mm

DUAL

5 mm

HARDWARE/SOFTWARE

CY15V102QN-50LHXIT by Infineon Technologies

CY15V102QN-50LHXIT

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 256K;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PDSO-N8

6 mm

2097152 bit

FRAM

8

3

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

.8 mm

SPI

.000065 Amp

1.71 V

3.7 mA

1.89 V

1.71 V

1.8

YES

CMOS

NO LEAD

1.27 mm

DUAL

5 mm

HARDWARE/SOFTWARE

CY15B102QN-50SXIT by Infineon Technologies

CY15B102QN-50SXIT

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz; No. of Functions: 1;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PDSO-G8

5.28 mm

2097152 bit

FRAM

8

3

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

SOP

SOP8,.3

RECTANGULAR

SMALL OUTLINE

SERIAL

2.03 mm

SPI

.00007 Amp

1.8 V

3.7 mA

3.6 V

1.8 V

3.3

YES

CMOS

GULL WING

1.27 mm

DUAL

5.23 mm

HARDWARE/SOFTWARE

CY15B116QN-40BKXA by Infineon Technologies

CY15B116QN-40BKXA

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Maximum Supply Current: 4.3 mA;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002535 Amp

1.8 V

4.3 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V116QN-40BKXAT by Infineon Technologies

CY15V116QN-40BKXAT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Package Body Material: PLASTIC/EPOXY;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002525 Amp

1.71 V

3.6 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V116QN-40BKXA by Infineon Technologies

CY15V116QN-40BKXA

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Technology: CMOS; Serial Bus Type: SPI;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002525 Amp

1.71 V

3.6 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B116QN-40BKXAT by Infineon Technologies

CY15B116QN-40BKXAT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE; Package Style (Meter): GRID ARRAY, THIN PROFILE;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002535 Amp

1.8 V

4.3 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QSN-108BKXI by Infineon Technologies

CY15B108QSN-108BKXI

Infineon Technologies

Infineon CY15B108QSN-108BKXI FRAM offers 1MX8 organization, operates at 108 MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance with 100T write/erase cycles, such as industrial automation and IoT devices.

108 MHz

10

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000435 Amp

27.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QSN-108BKXI by Infineon Technologies

CY15V108QSN-108BKXI

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Package Equivalence Code: BGA24,5X5,40;

108 MHz

10

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000435 Amp

27.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXIT by Infineon Technologies

CY15B108QN-50BKXIT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH; No. of Functions: 1;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.8 V

4.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXIT by Infineon Technologies

CY15V108QN-50BKXIT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Write Protection: HARDWARE/SOFTWARE;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.71 V

4.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXI by Infineon Technologies

CY15B108QN-50BKXI

Infineon Technologies

Infineon's CY15B108QN-50BKXI FRAM offers 1MX8 organization, operates at 50MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance, such as IoT devices and industrial automation systems.

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.8 V

4.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXI by Infineon Technologies

CY15V108QN-50BKXI

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 6 mm; No. of Functions: 1;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.71 V

4.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXQT by Infineon Technologies

CY15B108QN-50BKXQT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Serial Bus Type: SPI;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000305 Amp

1.8 V

8 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXQ by Infineon Technologies

CY15B108QN-50BKXQ

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Minimum Operating Temperature: -40 Cel;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000305 Amp

1.8 V

8 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXQ by Infineon Technologies

CY15V108QN-50BKXQ

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8; Write Protection: HARDWARE/SOFTWARE;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.0003 Amp

1.71 V

7.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXQT by Infineon Technologies

CY15V108QN-50BKXQT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.89 V; Minimum Operating Temperature: -40 Cel;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.0003 Amp

1.71 V

7.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE