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SQUARE Flash Memory 171

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S25HL512TDPBHM013 by Infineon Technologies

S25HL512TDPBHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Moisture Sensitivity Level (MSL): 3;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHI013 by Infineon Technologies

S25HS512TFABHI013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Terminal Pitch: 1 mm;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHM010 by Infineon Technologies

S25HS512TFABHM010

Infineon Technologies

Infineon's S25HS512TFABHM010 is a 64MX8 NOR flash memory with 166 MHz clock frequency, suitable for automotive applications due to AEC-Q100 screening. Operating at 1.8V, it offers 1280000 write/erase cycles and features SPI serial bus interface.

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHM013 by Infineon Technologies

S25HS512TFABHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Write Protection: HARDWARE; Width: 8 mm;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHB013 by Infineon Technologies

S25HS512TFABHB013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Surface Mount: YES;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPBHV013 by Infineon Technologies

S25HL512TDPBHV013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Minimum Data Retention Time: 25; Maximum Standby Current: .00034 Amp;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPBHI010 by Infineon Technologies

S25HL512TDPBHI010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3; Package Body Material: PLASTIC/EPOXY;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFABHB013 by Infineon Technologies

S25HL512TFABHB013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; Minimum Data Retention Time: 25;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFABHM013 by Infineon Technologies

S25HL512TFABHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Minimum Data Retention Time: 25;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTDPBHB030 by Infineon Technologies

S25HS01GTDPBHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Form: BALL; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTDPBHV033 by Infineon Technologies

S25HS01GTDPBHV033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Write Protection: HARDWARE; Maximum Seated Height: 1 mm;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTFABHA033 by Infineon Technologies

S25HS01GTFABHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 166 MHz; Maximum Seated Height: 1 mm;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTFABHB030 by Infineon Technologies

S25HS01GTFABHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; No. of Words Code: 128M;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHB010 by Infineon Technologies

S25HS512TDPBHB010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Package Body Material: PLASTIC/EPOXY;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHM010 by Infineon Technologies

S25HS512TDPBHM010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Technology: CMOS; Minimum Supply Voltage (Vsup): 1.7 V;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHV010 by Infineon Technologies

S25HS512TDPBHV010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Maximum Clock Frequency (fCLK): 133 MHz;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHB050 by Infineon Technologies

S25HS02GTDZBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHM053 by Infineon Technologies

S25HS02GTDZBHM053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Length: 8 mm; Maximum Operating Temperature: 125 Cel;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

125 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.001 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTFABHV150 by Infineon Technologies

S25HL02GTFABHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3; Programming Voltage (V): 3;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

130 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTFABHV153 by Infineon Technologies

S25HL02GTFABHV153

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Type: NOR TYPE;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

130 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDPBHV153 by Infineon Technologies

S25HL02GTDPBHV153

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, THIN PROFILE; JESD-30 Code: S-PBGA-B24;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDZBHB050 by Infineon Technologies

S25HL02GTDZBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Package Equivalence Code: BGA24,5X5,40;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

AEC-Q100

1.2 mm

SPI

.000655 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHM050 by Infineon Technologies

S25HS02GTDZBHM050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Programming Voltage (V): 1.8;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

125 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.001 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDPBHV150 by Infineon Technologies

S25HS02GTDPBHV150

Infineon Technologies

S25HS02GTDPBHV150 by Infineon Technologies is a 256MX8 NOR type flash memory with a max clock frequency of 166 MHz. It operates in synchronous mode and has a min data retention time of 25 years. This flash memory is commonly used in applications such as consumer electronics, automotive systems, and industrial equipment.

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDPBHV150 by Infineon Technologies

S25HL02GTDPBHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Type: NOR TYPE;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDZBHB053 by Infineon Technologies

S25HL02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Memory Density: 2147483648 bit; Write Protection: HARDWARE;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

AEC-Q100

1.2 mm

SPI

.000655 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHB053 by Infineon Technologies

S25HS02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Moisture Sensitivity Level (MSL): 3;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE