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MT90869AG2

Zarlink Semiconductor

MT90869AG2 by Zarlink Semiconductor

DIGITAL TIME SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

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AZTECH Wire

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Technical Specifications

Telecom - Switching ICs MT90869AG2 attributes and parameters. Explore more Telecom - Switching ICs devices from Zarlink Semiconductor

Specs

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

272

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.32 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Trade Compliance

MT90869AG2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Zarlink Semiconductor

Zarlink Semiconductor - Microsemi Company Overview Zarlink Semiconductor was acquired by Microsemi as of October 2011. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Zarlink Semiconductor - Microsemi Products The types of products manufactured by Zarlink Semiconductor - Microsemi include Analog Switches, Medical Surge Protection ICs, Laser Diode Drivers (LDD), Analog Amplifiers, Telephony ICs, Packet Processing ICs, Packet Switching ICs, Timing and Synchronization (DS1/E1, SONET/SDH) ICs, TDM/TSI Switches, ATM (Asynchronous Transfer Mode) ICs, Voice Processing ICs, Optoelectronic Products, Frequency Synthesis Products, Wireless Data Products, Ultra-low Power Communication Products, Baseband Signal Processing Products, and Cellular Telephony Products.

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