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1SS184-T1

Won-top Electronics

1SS184-T1 by Won-top Electronics

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Diodes & Rectifiers 1SS184-T1 attributes and parameters. Explore more Diodes & Rectifiers devices from Won-top Electronics

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.15 W

Maximum Repetitive Peak Reverse Voltage:

85 V

Maximum Reverse Recovery Time:

.004 us

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

1SS184-T1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Won-top Electronics

Established in 1992, Won-Top Electronics is dedicated to providing customers with optimized discrete semiconductors at competitive cost. Combining leading foundry technologies, proprietary packaging architectures, and excellent thermal performance, our solutions help customers solve design challenges in automotive, automotive aftermarket, consumer, computer, lighting, communication, energy harvesting, and smart grid applications. Our diverse portfolio of discrete semiconductors includes, Automotive Diodes Bridge Rectifiers Power Rectifiers: Schottky, Superfast, Ultrafast, Fast Recovery, Standard Recovery Small Signal Schottky Diodes and Small Signal Switching Diodes Protection Devices: Zener, TVS Diodes Corporate headquarter and design center are located in Kaohsiung, Taiwan, with manufacturing facilities in Shanghai and Shandong, China of total 10,500 M2 floor space. More than 9 billion devices are produced in 2012 in a variety of SMD, powerpack, and axial packages and have been distributed to customers in America, Europe, Asia, and Middle East regions.

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