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910-40-2-33-1-B-1

Wakefield Thermal Solutions

910-40-2-33-1-B-1 by Wakefield Thermal Solutions

HEAT SINK; Profile: CLIP; Body Material: ALUMINIUM ALLOY; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: PIN FIN;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Heat Sinks 910-40-2-33-1-B-1 attributes and parameters. Explore more Heat Sinks devices from Wakefield Thermal Solutions

Device Specifications

Construction:

Profile:

Fin Orientation:

Physical Specifications

Height:

0.472 in (12 mm)

Width:

1.575 in (40 mm)

Length:

1.575 in (40 mm)

Material and Finish

Finish:

Black Anodized

Body Material Composition:

Thermal Specifications

Thermal Resistance:

9.18 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Wakefield Thermal Solutions

Wakefield Thermal has been in continuous operations since 1957, providing thermal solutions across multiple industries, from international Fortune 50 companies to small and medium sized businesses. Industries served include Power Conversion, Information Technology, Renewable Energy, Telecommunications, Transportation, Aerospace/Defense, LED Lighting, Factory Automation, Consumer, and Medical. The thermal solutions Wakefield Thermal manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield Thermal unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today's ever-higher electronics packaging densities.

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