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TFDU6103-TT3

Vishay Intertechnology

TFDU6103-TT3 by Vishay Intertechnology

Vishay Intertechnology's TFDU6103-TT3 is a CMOS interface IC with 8 terminals, operating voltage range of 2.4V to 5.5V, and peak reflow temperature of 260°C. It is designed for applications requiring microelectronic assembly in a compact rectangular package style, suitable for use in various interface circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 15,580 parts In-Stock

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15,580

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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20

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Distributors (Availability)

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AZTECH Wire

Italy . 364 parts In-Stock

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$19.303

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364

$19.303

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Semicontronic

India . 1,642 parts In-Stock

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$38.500

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$37.538

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$37.345

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1,642

$38.500

$37.538

$37.345

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Ampacity Inc.

Singapore . 384 parts In-Stock

1+ parts

$46.500

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384

$46.500

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Continental Prestige Electronics

USA . 1,012 parts In-Stock

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1,012

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 224 parts In-Stock

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224

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Kepictronics

USA . 100 parts In-Stock

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100

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Epart123

USA . 20 parts In-Stock

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Overview

Elevate your electronic designs with the TFDU6103-TT3 by Vishay Intertechnology, a leading manufacturer known for its top-notch quality and reliability. This innovative interface circuit IC offers unparalleled performance, making it ideal for a wide range of applications. With its surface mount design and compact package style, this product provides convenience and efficiency in your projects. Experience seamless connectivity and precise functionality with the TFDU6103-TT3, setting a new standard in the industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, reducing production time and cost.

Maximum Supply Voltage: 5.5 V

Wide maximum supply voltage range provides flexibility in power supply options for various applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during manufacturing and assembly processes.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability under demanding operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good electrical conductivity and solderability for reliable connections.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Other Function Interface ICs TFDU6103-TT3 attributes and parameters. Explore more Other Function Interface ICs devices from Vishay Intertechnology

Specs

Interface IC Type:

JESD-30 Code:

R-XSMA-L8

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.4 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

10

Width:

4.7 mm

Trade Compliance

TFDU6103-TT3 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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