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SUP75P03-07-E3

Vishay Intertechnology

SUP75P03-07-E3 by Vishay Intertechnology

Vishay Intertechnology's SUP75P03-07-E3 is a P-channel Power FET with 30V DS breakdown voltage and 0.007 ohm RDS(on). Ideal for high-power applications, it features 240A IDM, 75A ID, and 187W Pd max. Suitable for enhancement mode operation in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,847 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,909 parts In-Stock

1+ parts

$0.589

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4,909

$0.589

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Advanced Electronics

New Zealand . 56 parts In-Stock

1+ parts

$2.318

100+ parts

$2.109

1k+ parts

$1.901

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56

$2.318

$2.109

$1.901

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Corohmni

South Africa . 151 parts In-Stock

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$2.870

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151

$2.870

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AZTECH Wire

Italy . 640 parts In-Stock

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$10.367

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640

$10.367

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Ampacity Inc.

Singapore . 587 parts In-Stock

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$46.050

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587

$46.050

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Semicontronic

India . 425 parts In-Stock

1+ parts

$61.050

100+ parts

$59.524

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$59.218

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425

$61.050

$59.524

$59.218

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Kepictronics

USA . 27,983 parts In-Stock

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Perfect Parts

USA . 10,959 parts In-Stock

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10,959

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Argo Parts USA

USA . 4,057 parts In-Stock

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4,057

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Continental Prestige Electronics

USA . 1,222 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the power and efficiency of the SUP75P03-07-E3 by Vishay Intertechnology. Crafted with precision and reliability, this P-Channel Power Field Effect Transistor offers top-notch performance for a variety of applications. Whether you're looking to enhance your electronic devices or elevate your power management systems, this FET delivers unparalleled value, benefits, and advantages. Trust Vishay Intertechnology to provide innovative solutions that meet your needs and exceed your expectations. Experience the difference with the SUP75P03-07-E3 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration offers lower on-resistance and better conduction efficiency compared to N-channel types, making this FET suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this FET a convenient choice for compact electronic systems.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle high voltage applications reliably without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape of the package provides easy mounting and assembly, making it user-friendly for installation in various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and ease of soldering, ensuring stable performance in demanding operating conditions.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of the FET's conductivity, making it versatile for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 240 A

With a high maximum pulsed drain current of 240A, this FET is suitable for applications requiring high power handling capabilities.

Maximum Drain Current (Abs) (ID): 75 A

The high maximum drain current of 75A ensures reliable performance in demanding applications where power consumption is a critical factor.

No. of Terminals: 3

The three-terminal design allows for easy integration into existing circuit designs, making this FET a versatile choice for various electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) SUP75P03-07-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SUP75P03-07-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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