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SM15T36A-E3/9AT

Vishay Intertechnology

SM15T36A-E3/9AT by Vishay Intertechnology

Vishay Intertechnology's SM15T36A-E3/9AT is a single-configured transient suppression device with a max non-repetitive peak reverse power dissipation of 1500W. It has a breakdown voltage of 36V and is suitable for applications requiring protection against voltage transients.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,618 parts In-Stock

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6,618

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 1,616 parts In-Stock

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$0.010

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$0.010

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$0.010

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1,616

$0.010

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Corohmni

South Africa . 30 parts In-Stock

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$0.111

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Aztec Data Supply Inc.

USA . 3,425 parts In-Stock

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$0.120

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3,425

$0.120

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Ampacity Inc.

Singapore . 428 parts In-Stock

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$1.010

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428

$1.010

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AZTECH Wire

Italy . 202 parts In-Stock

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$15.204

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202

$15.204

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Argo Parts USA

USA . 1,814 parts In-Stock

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Continental Prestige Electronics

USA . 794 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Overview

Experience the next level of protection with the SM15T36A-E3/9AT by Vishay Intertechnology. As a leading manufacturer in the industry, Vishay Intertechnology delivers unrivaled quality and reliability. The SM15T36A-E3/9AT is a transient suppression device designed to safeguard your electronic circuits from voltage spikes and surges. Its compact size and surface mount capability make it ideal for a wide range of applications. With a maximum clamping voltage of 49.9V and a nominal breakdown voltage of 36V, this diode offers unparalleled protection for your valuable electronics. Don't compromise on the safety of your devices - choose Vishay Intertechnology for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the device, making it suitable for various environments.

Config:

SINGLE - The single configuration simplifies installation and reduces component count, making it a cost-effective choice.

Surface Mount:

YES - The surface-mount capability enables easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Non Repetitive Peak Reverse Power Dissipation:

1500 W - With a high power dissipation capacity, this product is capable of handling large transient power surges, ensuring reliable operation.

Nominal Breakdown Voltage:

36 V - The nominal breakdown voltage ensures effective suppression of voltage spikes, safeguarding sensitive electronics.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient packing and placement on circuit boards, optimizing space utilization.

No. of Terminals:

2 - The two-terminal configuration provides simple connectivity, minimizing complexity in circuit design.

Package Style (Meter):

SMALL OUTLINE - The small outline package style offers ease of handling and compatibility with automated manufacturing processes.

Maximum Operating Temperature:

150 °C - The high maximum operating temperature allows for reliable performance in various operating conditions.

Minimum Operating Temperature:

65 °C - The low minimum operating temperature ensures the product can withstand extreme environmental conditions.

Terminal Finish:

MATTE TIN - The matte tin terminal finish enhances solderability, facilitating a reliable and robust electrical connection.

Terminal Position:

DUAL - The dual terminal position allows for flexibility in circuit assembly, accommodating different layout requirements.

Maximum Power Dissipation:

6.5 W - This high power dissipation capability ensures the device can handle transient power surges, preventing damage to connected equipment.

Minimum Breakdown Voltage:

34.2 V - The minimum breakdown voltage ensures effective voltage clamping, protecting downstream components from excessive voltage levels.

Maximum Time At Peak Reflow Temperature (s):

30 - The short maximum reflow time allows for efficient and reliable soldering during assembly processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures proper soldering and robust mechanical connections.

Maximum Breakdown Voltage:

37.8 V - With a high maximum breakdown voltage, this device provides effective voltage protection against transient events.

Diode Type:

TRANS VOLTAGE SUPPRESSOR DIODE - This diode type offers excellent voltage clamping characteristics, guarding against voltage spikes.

Technology:

AVALANCHE - The avalanche technology provides fast and responsive protection against voltage transients, ensuring the safety of connected devices.

Terminal Form:

C BEND - The C bend terminal form facilitates easy and secure electrical connections during soldering and assembly processes.

No. of Elements:

1 - With a single element, this device offers simplicity in circuit design and ease of use.

Maximum Repetitive Peak Reverse Voltage:

30.8 V - The maximum repetitive peak reverse voltage rating ensures reliable and continuous operation under normal conditions.

Moisture Sensitivity Level (MSL):

1 - The moisture sensitivity level indicates that this device is moisture resistant, reducing the risk of damage during assembly and operation.

Polarity:

UNIDIRECTIONAL - The unidirectional polarity ensures effective protection in one direction, safeguarding against transient voltage events.

Maximum Clamping Voltage:

49.9 V - The high maximum clamping voltage indicates effective voltage suppression capability, preventing damage to downstream components.

Diode Element Material:

SILICON - The diode element material of silicon provides reliable and robust performance in suppressing voltage transients.

Technical Specifications

Transient Suppression Devices SM15T36A-E3/9AT attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

Maximum Breakdown Voltage:

37.8 V

Minimum Breakdown Voltage:

34.2 V

Nominal Breakdown Voltage:

36 V

Maximum Clamping Voltage:

49.9 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

1500 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

6.5 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30.8 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SM15T36A-E3/9AT Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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