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MDP1601103G

Vishay Intertechnology

MDP1601103G by Vishay Intertechnology

Vishay Intertechnology's MDP1601103G resistor network has 15 elements with 10000 ohm resistance each. With a power dissipation of 0.19 W and tolerance of 2%, it is ideal for through-hole mounting applications in various electronic circuits. Operating temperature range from -55 to 150 °C ensures reliable performance in diverse environments.

Median Price

$1.540

Lifecycle Status

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American Microsemiconductor Inc.

USA . 158 parts In-Stock

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Component Electronics Inc.

Canada . 106 parts In-Stock

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Nova Conductors

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Carlin Systems, Inc.

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Legend Electronics Inc.

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Manoshevitz Elec. Sales

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Sunrise Surplus Inc.

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AZTECH Wire

Italy . 696 parts In-Stock

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Overview

Upgrade your electronic devices with the MDP1601103G resistor network by Vishay Intertechnology, a leading manufacturer known for its top-notch quality and reliability. Perfect for a wide range of applications, this resistor array offers unmatched performance and precision. With a rated power dissipation of 3W and a tolerance of 2%, this rectangular package features 15 elements and is designed for easy through-hole mounting. Trust Vishay Intertechnology to provide you with the best components for your projects, ensuring optimal functionality and longevity.

Feature Benefit Bullets

Element Power Dissipation: 0.19 W

Low power dissipation makes it suitable for applications where energy efficiency is important.

Rated Temperature: 25 °C

Stable performance at room temperature ensures reliability in normal operating conditions.

Technology: METAL GLAZE/THICK FILM

Metal glaze and thick film technology provide high reliability and stability over time.

No. of Elements: 15

Multiple elements allow for a more complex and customized circuit design.

Packing Method: TUBE

Tube packing method provides convenience for storage and handling.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the circuit.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in a wide range of environments.

Resistor Type: ARRAY/NETWORK RESISTOR

Array/network resistor type facilitates easier installation and wiring in complex circuits.

Tolerance: 2 %

Tight tolerance ensures accurate and consistent resistance values.

Mounting Type: THROUGH HOLE MOUNT

Through hole mounting provides secure attachment to the circuit board.

Rated Power Dissipation (P): 3 W

High rated power dissipation capability allows for handling of higher power loads.

Technical Specifications

Resistor Networks & Arrays MDP1601103G attributes and parameters. Explore more Resistor Networks & Arrays devices from Vishay Intertechnology

Specs

Element Power Dissipation:

.19 W

First Element Resistance:

10000 ohm

JESD-609 Code:

e0

Mounting Type:

Network Type:

BUSSED

No. of Elements:

15

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Shape (Package):

RECTANGULAR PACKAGE

Packing Method:

TUBE

Rated Power Dissipation (P):

3 W

Rated Temperature:

25 Cel

Resistor Type:

Technology:

METAL GLAZE/THICK FILM

Temperature Coef (ppm/Cel):

100

Temperature Coef Tracking:

50 ppm/Cel

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Shape:

FLAT

Tolerance:

2 %

Trade Compliance

MDP1601103G Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.60

SB

8533.21.00.75

NSN

5905-01-155-6492, 5905011556492

NIIN

011556492

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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