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NE555-D08-T

Unisonic Technologies

NE555-D08-T by Unisonic Technologies

SQUARE; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Analog Waveform Generation NE555-D08-T attributes and parameters. Explore more Analog Waveform Generation devices from Unisonic Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.2 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.31 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NE555-D08-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Unisonic Technologies

Unisonic Technologies Company Limited was set up in 1990, and it is the manufacturing supplier for high-tech semiconductor devices and IC design, and its products are mainly of Power Management, and Audio Power Amplifier IC, supplemented with Motor Controller, OP, and TR. These components are primarily used in the market of PC, telecom, and consumer products, and they are sold throughout Asian area, while the company also owns direct branch in South Korea, Thailand, and India. The difference to develop a completely diverse service model from that of previous one in OEM/OEM lies on the fact that IDM would resort to more aggressive manner of approach, and one would have to fully master its independent competence in every critical point from the research and development, design, manufacturing, packaging, testing, and to the marketing of brand name. As such, it would achieve the advantage of productivity security and technical independence, which is different from the commissioned OEM model of domestic vendor supplier and would fully demonstrate its competitiveness.

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